Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Novel Approaches for Minimizing Pad Cratering
With the electronic industry moving towards lead-free assembly,traditional SnPb-compatible laminates need to be replaced with lead-free compatible laminates that can withstand the higher reflow
.. read more
Conformal Coating over No Clean Flux
As the proliferation of modern day electronics continues to drive miniaturization and functionality,electronic designers/assemblers face the issue of environmental exposure and uncommon applica
.. read more
Controlling Moisture During Inner Layer Processing
•Two primary failure modes from trapped moisture:
•Premature resin decomposition from incomplete resin cross-linking.
•Explosive vaporization during high temperature thermal exposure.
.. read more
Effect of Toughening and E-Glass Sizing on Fracture Toughness and Delamination in High Thermal Stability Electrical Laminates
In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results
.. read more
A Time Dependent Analytical Analysis of Heat Transfer in A PCB during A Thermal Excursion
A great deal of work has already been done to determine the equilibrium temperature of a PCB when exposed to a heat source such as the thermal environment of reflow soldering. This study will g
.. read more
Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment
.. read more
The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials
This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir
.. read more
Screening for Counterfeit Electronic Parts
Counterfeit electronic parts have become a significant cause of worry in the electronics part supply chain. Most of the counterfeit parts detected in the electronics industry are either new or
.. read more
High Density Packaging User Group – Pb-free Materials 2 Project Materials Testing of PWB Substrates to Establish Variability of Construction,...
An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater
.. read more
Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning
The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring
.. read more
An Analytical Characterization and Comparison of Adhesion Test for PCBs
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes which severely stress the mecha
.. read more
HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination
As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on
.. read more
Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour
High levels of residual moisture in PCBs are problematic and can result in delamination during soldering and rework. Moisture accumulates during storage and industry practice recommends specifi
.. read more
Assessment of Moisture Content Measurement Methods for Printed Circuit Boards
Using embedded structures in printed circuit boards,changes in moisture content have been monitored using route-impulse-energy measurement,capacitance measurement and weight gain. All three met
.. read more
Pb-Free Reflow,PCB Degradation,and the Influence of Moisture Absorption
Cracking and delamination defects in printed circuit boards (PCBs) during elevated thermal exposure have always been a concern for the electronics industry. However,with the increasing spread o
.. read more
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. read more
MSL Rating and Packaging Requirements of PCBs used in Board Mounted Power Assemblies
In recent years there has been an increasing emphasis on miniaturization of Board Mount Power (BMP) modules and electronic subassemblies. In addition there has been a shift from predominately t
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Reflow Defects with Lead-Free Soldering Moisture Sensitive Components
Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav
.. read more
A Novel Approach to Evaluate the Impact on Solder Joint Reliability due to Multiple BGA Rework
PCB assemblies with numerous BGAs often go through multiple BGA reworks but there is not much data to suggest its effect
on the long term solder joint reliability of the BGAs. This study is foc
.. read more
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. read more
An Issue in Time to Delamination (T260) Testing for PCBs
It has been reported by several laboratories that the time to delamination or decomposition of a printed circuit board specimen
at 260°C decreases with the specimen thickness. A temperature gra
.. read more
The Effect of Thermal Loaded Bend Test on the Solder Joint Reliability
With the function of today’s electronic devices become more and more complicate,the high I/O flip chip ball grid array
package (FCBGA) is used more popularly in recent years. The FCBGA package
.. read more
Moisture and Reflow Sensitivity Evaluations of SMT Packages as a Function of Reflow Profile at Eutectic and Lead Free Temperatures
Epoxy molding compounds are used extensively in the electronics industry to encapsulate surface mount Integrated Circuits
(ICs). The primary purpose of encapsulating the SMT package using these
.. read more
Development of Epoxy Mold Compound for Lead Free Soldering of Fine Pitch and Stacked Die BGA Packages
A new,green epoxy mold compound has been developed to encapsulate fine pitch PBGA and 3D-stacked die CSP packages.
When evaluated on these packages,the compound provided very good wire sweep pe
.. read more
Mechanical Bending Technique for Determining CSP Design and Assembly Weaknesses
A cyclic board-bending technique has been developed to ensure a reproducible multiaxial stress state at the Chip
Size Package (CSP) solder fillet. Mechanically stressing the package serves as a
.. read more
Novel Approaches for Minimizing Pad Cratering
With the electronic industry moving towards lead-free assembly,traditional SnPb-compatible laminates need to be replaced with lead-free compatible laminates that can withstand the higher reflow
.. read more
Conformal Coating over No Clean Flux
As the proliferation of modern day electronics continues to drive miniaturization and functionality,electronic designers/assemblers face the issue of environmental exposure and uncommon applica
.. read more
Controlling Moisture During Inner Layer Processing
•Two primary failure modes from trapped moisture:
•Premature resin decomposition from incomplete resin cross-linking.
•Explosive vaporization during high temperature thermal exposure.
.. read more
Effect of Toughening and E-Glass Sizing on Fracture Toughness and Delamination in High Thermal Stability Electrical Laminates
In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results
.. read more
A Time Dependent Analytical Analysis of Heat Transfer in A PCB during A Thermal Excursion
A great deal of work has already been done to determine the equilibrium temperature of a PCB when exposed to a heat source such as the thermal environment of reflow soldering. This study will g
.. read more
Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment
.. read more
The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials
This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir
.. read more
Screening for Counterfeit Electronic Parts
Counterfeit electronic parts have become a significant cause of worry in the electronics part supply chain. Most of the counterfeit parts detected in the electronics industry are either new or
.. read more
High Density Packaging User Group – Pb-free Materials 2 Project Materials Testing of PWB Substrates to Establish Variability of Construction,...
An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater
.. read more
Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning
The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring
.. read more
An Analytical Characterization and Comparison of Adhesion Test for PCBs
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes which severely stress the mecha
.. read more
HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination
As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on
.. read more
Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour
High levels of residual moisture in PCBs are problematic and can result in delamination during soldering and rework. Moisture accumulates during storage and industry practice recommends specifi
.. read more
Assessment of Moisture Content Measurement Methods for Printed Circuit Boards
Using embedded structures in printed circuit boards,changes in moisture content have been monitored using route-impulse-energy measurement,capacitance measurement and weight gain. All three met
.. read more
Pb-Free Reflow,PCB Degradation,and the Influence of Moisture Absorption
Cracking and delamination defects in printed circuit boards (PCBs) during elevated thermal exposure have always been a concern for the electronics industry. However,with the increasing spread o
.. read more
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. read more
MSL Rating and Packaging Requirements of PCBs used in Board Mounted Power Assemblies
In recent years there has been an increasing emphasis on miniaturization of Board Mount Power (BMP) modules and electronic subassemblies. In addition there has been a shift from predominately t
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Reflow Defects with Lead-Free Soldering Moisture Sensitive Components
Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav
.. read more
A Novel Approach to Evaluate the Impact on Solder Joint Reliability due to Multiple BGA Rework
PCB assemblies with numerous BGAs often go through multiple BGA reworks but there is not much data to suggest its effect
on the long term solder joint reliability of the BGAs. This study is foc
.. read more
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. read more
An Issue in Time to Delamination (T260) Testing for PCBs
It has been reported by several laboratories that the time to delamination or decomposition of a printed circuit board specimen
at 260°C decreases with the specimen thickness. A temperature gra
.. read more
The Effect of Thermal Loaded Bend Test on the Solder Joint Reliability
With the function of today’s electronic devices become more and more complicate,the high I/O flip chip ball grid array
package (FCBGA) is used more popularly in recent years. The FCBGA package
.. read more
Moisture and Reflow Sensitivity Evaluations of SMT Packages as a Function of Reflow Profile at Eutectic and Lead Free Temperatures
Epoxy molding compounds are used extensively in the electronics industry to encapsulate surface mount Integrated Circuits
(ICs). The primary purpose of encapsulating the SMT package using these
.. read more
Development of Epoxy Mold Compound for Lead Free Soldering of Fine Pitch and Stacked Die BGA Packages
A new,green epoxy mold compound has been developed to encapsulate fine pitch PBGA and 3D-stacked die CSP packages.
When evaluated on these packages,the compound provided very good wire sweep pe
.. read more
Mechanical Bending Technique for Determining CSP Design and Assembly Weaknesses
A cyclic board-bending technique has been developed to ensure a reproducible multiaxial stress state at the Chip
Size Package (CSP) solder fillet. Mechanically stressing the package serves as a
.. read more