Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Electrochemical Methods to Measure the Corrosion Potential of Flux Residues
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance d
.. read more
PCB Cleanliness Assessment Methodologies - A Comparative Study
PCB manufacturers use a wide variety of solder pastes and fluxes including No-Clean,RMA and OA,both leaded and lead-free within their processes. As part of the manufacturing process,components
.. read more
Thermal Profile Variation and PCB Reliability
When designing PCBs,solder paste selection is critical. Once a specific paste type and supplier are identified,the manufacturing process is developed and refined. Critical to the quality of the
.. read more
Test Method Development for Detecting Pitting/Crevice Corrosion Formation on Electronic Assemblies
Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit
.. read more
IPC-CC-830B Versus the 'Real World': Part 2
Conformal Coatings are often used to increase the reliability of electronic assemblies operating in harsh or corrosive environments where the product would otherwise fail prematurely. Conformal
.. read more
Effects of Solder Mask on Electrochemical Migration of Tin-Lead and Lead-Free Boards
Electrochemical migration (ECM) is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM can cause a reduction i
.. read more
Electrochemical Methods to Measure the Corrosion Potential of Flux Residues
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance d
.. read more
PCB Cleanliness Assessment Methodologies - A Comparative Study
PCB manufacturers use a wide variety of solder pastes and fluxes including No-Clean,RMA and OA,both leaded and lead-free within their processes. As part of the manufacturing process,components
.. read more
Thermal Profile Variation and PCB Reliability
When designing PCBs,solder paste selection is critical. Once a specific paste type and supplier are identified,the manufacturing process is developed and refined. Critical to the quality of the
.. read more
Test Method Development for Detecting Pitting/Crevice Corrosion Formation on Electronic Assemblies
Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit
.. read more
IPC-CC-830B Versus the 'Real World': Part 2
Conformal Coatings are often used to increase the reliability of electronic assemblies operating in harsh or corrosive environments where the product would otherwise fail prematurely. Conformal
.. read more
Effects of Solder Mask on Electrochemical Migration of Tin-Lead and Lead-Free Boards
Electrochemical migration (ECM) is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM can cause a reduction i
.. read more