Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Materials Compatibility and Aging for Flux and Cleaner Combinations
A materials study of high reliability electronics cleaning is presented here. In Phase 1,mixed type substrates underwent a condensed contaminants application to view a worst-case scenario for
.. read more
Correlation of Sir,Halide/Halogen,and Copper Mirror Tests
With the advent of RoHS and WEEE and the concern of some companies to eliminate halogen-containing compounds from their products,it is vital to have an understanding of halogen compounds and ho
.. read more
Effect of Silicone Conformal Coating on Surface Insulation Resistance (SIR) For Printed Circuit Board Assemblies.
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons:
.. read more
Analysis of Electrochemical Migration Kinetics Using Electrochemical Impedance Spectroscopy
The propensity of printed circuit boards to electrochemical migration has been assessed traditionally by using surface insulation resistance technique with a DC bias on standard comb structures
.. read more
Understanding SIR
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ
significantly from those stated by the solder material provider. The
.. read more
Solder Paste Residue Corrosivity Assessment: Bono Test
Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00
.. read more
Parylene as a Suppressant for Tin Whiskers Growth on Printed Circuit Boards
With the implementation of RoHS directives,pure tin plating is replacing lead in the tin-alloy used in the printed circuit boards and other worldwide electronics. Although use of tin provides a
.. read more
Effects of Cooling Slopes in Lead Free Reflow
As more electronic assemblers move to lead free SMT production,concerns are raised over reflow cooling slopes and effects
on solder joints. Due to the higher peak temperatures,cooling slopes ar
.. read more
Test Setup,Procedures and Patterns for Conductive Anodic Filament (CAF) and Electrochemical Migration (ECM) Testing
Reliability assessment of Printed Wiring Boards and Assemblies using High Humidity at elevated temperatures has been done for a number of years. Many companies,including the IPC have published
.. read more
Materials Compatibility and Aging for Flux and Cleaner Combinations
A materials study of high reliability electronics cleaning is presented here. In Phase 1,mixed type substrates underwent a condensed contaminants application to view a worst-case scenario for
.. read more
Correlation of Sir,Halide/Halogen,and Copper Mirror Tests
With the advent of RoHS and WEEE and the concern of some companies to eliminate halogen-containing compounds from their products,it is vital to have an understanding of halogen compounds and ho
.. read more
Effect of Silicone Conformal Coating on Surface Insulation Resistance (SIR) For Printed Circuit Board Assemblies.
Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons:
.. read more
Analysis of Electrochemical Migration Kinetics Using Electrochemical Impedance Spectroscopy
The propensity of printed circuit boards to electrochemical migration has been assessed traditionally by using surface insulation resistance technique with a DC bias on standard comb structures
.. read more
Understanding SIR
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ
significantly from those stated by the solder material provider. The
.. read more
Solder Paste Residue Corrosivity Assessment: Bono Test
Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00
.. read more
Parylene as a Suppressant for Tin Whiskers Growth on Printed Circuit Boards
With the implementation of RoHS directives,pure tin plating is replacing lead in the tin-alloy used in the printed circuit boards and other worldwide electronics. Although use of tin provides a
.. read more
Effects of Cooling Slopes in Lead Free Reflow
As more electronic assemblers move to lead free SMT production,concerns are raised over reflow cooling slopes and effects
on solder joints. Due to the higher peak temperatures,cooling slopes ar
.. read more
Test Setup,Procedures and Patterns for Conductive Anodic Filament (CAF) and Electrochemical Migration (ECM) Testing
Reliability assessment of Printed Wiring Boards and Assemblies using High Humidity at elevated temperatures has been done for a number of years. Many companies,including the IPC have published
.. read more