Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Monitoring the Cleaning Process using Industry 4.0 Methodology
Assemblers of printed circuit boards seek to provide their customers with high-quality products at the lowest possible cost. The total cost of production must take into account the complete pro
.. read more
Electrochemical Methods to Measure the Corrosion Potential of Flux Residues
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance d
.. read more
Materials Compatibility and Aging for Flux and Cleaner Combinations
A materials study of high reliability electronics cleaning is presented here. In Phase 1,mixed type substrates underwent a condensed contaminants application to view a worst-case scenario for
.. read more
Analysis of Electrochemical Migration Kinetics Using Electrochemical Impedance Spectroscopy
The propensity of printed circuit boards to electrochemical migration has been assessed traditionally by using surface insulation resistance technique with a DC bias on standard comb structures
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points
Hot gas rework of BGAs with a mirrored BGA design configuration using SnAgCu based lead-free alloys is more challenging as compared to conventional SnPb techniques. Rework of BGAs using a conve
.. read more
Determining the Reliability of Tacky Fluxes in Varying Soldering Applications
The use of tacky fluxes is common throughout the industry in applications such as ball attach,BGA repair and hand soldering. These applications employ different heating profiles,meaning that th
.. read more
Process Qualification Using the IPC-B-52 Standard Test Assembly
Many professionals in the electronics manufacturing industry have,or eventually will,face the issue of determining
whether the materials of construction for printed wiring assemblies (PWAs) are
.. read more
Monitoring the Cleaning Process using Industry 4.0 Methodology
Assemblers of printed circuit boards seek to provide their customers with high-quality products at the lowest possible cost. The total cost of production must take into account the complete pro
.. read more
Electrochemical Methods to Measure the Corrosion Potential of Flux Residues
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance d
.. read more
Materials Compatibility and Aging for Flux and Cleaner Combinations
A materials study of high reliability electronics cleaning is presented here. In Phase 1,mixed type substrates underwent a condensed contaminants application to view a worst-case scenario for
.. read more
Analysis of Electrochemical Migration Kinetics Using Electrochemical Impedance Spectroscopy
The propensity of printed circuit boards to electrochemical migration has been assessed traditionally by using surface insulation resistance technique with a DC bias on standard comb structures
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points
Hot gas rework of BGAs with a mirrored BGA design configuration using SnAgCu based lead-free alloys is more challenging as compared to conventional SnPb techniques. Rework of BGAs using a conve
.. read more
Determining the Reliability of Tacky Fluxes in Varying Soldering Applications
The use of tacky fluxes is common throughout the industry in applications such as ball attach,BGA repair and hand soldering. These applications employ different heating profiles,meaning that th
.. read more
Process Qualification Using the IPC-B-52 Standard Test Assembly
Many professionals in the electronics manufacturing industry have,or eventually will,face the issue of determining
whether the materials of construction for printed wiring assemblies (PWAs) are
.. read more