Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance

This slide show presents solutions to the relevant Power Module question: "What has to be considered within a PCB, if currents with about 50 A and voltages above 500 V should be designed?"&n .. read more

Next-Generation Additive Electronics -Precise Multi-Material Deposition for Circuits, Electro-Mechanical Parts and Antennas

This presentation covers additive manufacturing and the direct deposit of multiple metals.  This additive capability is best utilized for the production of complicated circuits such as .. read more

Impacts and Challenges of AME, from Design to Data

Complex geometries, customized parts and new processes; these are characteristics that are readily associated with additive manufacturing (AM). At the same time, they are often associated wi .. read more

Market Forecast and Applications for 3D Packaging using Package-on-Package (PoP)

- 3D Manufacturing solutions: Flexible integration - 3D/SiP Cost of Ownership - Die vs. Package Stack Analysis - Smartphone - Package evolution - Handheld Processor Roadmap - PoP - TMV - Future .. read more

Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance

This slide show presents solutions to the relevant Power Module question: "What has to be considered within a PCB, if currents with about 50 A and voltages above 500 V should be designed?"&n .. read more

Next-Generation Additive Electronics -Precise Multi-Material Deposition for Circuits, Electro-Mechanical Parts and Antennas

This presentation covers additive manufacturing and the direct deposit of multiple metals.  This additive capability is best utilized for the production of complicated circuits such as .. read more

Impacts and Challenges of AME, from Design to Data

Complex geometries, customized parts and new processes; these are characteristics that are readily associated with additive manufacturing (AM). At the same time, they are often associated wi .. read more

Market Forecast and Applications for 3D Packaging using Package-on-Package (PoP)

- 3D Manufacturing solutions: Flexible integration - 3D/SiP Cost of Ownership - Die vs. Package Stack Analysis - Smartphone - Package evolution - Handheld Processor Roadmap - PoP - TMV - Future .. read more