Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Additively Manufactured Electronics Technology
On November 15, 2023, we provided an overview of Additively Manufactured Electronics (AME)—a technology that enables 3D printing of functional circuit boards and advanced electronic devices.
.. read more
Pb-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs
As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s
.. read more
Common Mistakes in Electronic Design
Board-level designers are constantly expected to cram more computational power,into a smaller space,at lower cost,and accomplish this task in less time and with fewer resources. In this rush to
.. read more
DFM Rules for Smartphones: An Analysis of Yield on Extremely Dense Assemblies
Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in pa
.. read more
Design for Manufacturability in Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. read more
Design for Manufacturability in the Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. read more
New Reinforcement Material can Solve Heat and Co-Efficient of Thermal Expansion Challenges of the Printed Circuit Board and IC Substrate
Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s
.. read more
Changing the Methodology for DFM Moving from Design-Checker to Interactive,Informed Design Methodologies
The phrase "Design For Manufacture" strongly implies the use of manufacturing information while making of design decisions or,in other words,incorporating manufacturing knowledge during initial
.. read more
A Case Study of an OEM's Program to Assess Supplier Capabilities,Technology Availability,and Reliability for Advanced Printed Circuit Boards
Teradyne,Inc. has been involved with Conductor Analysis Technologies,Inc. (CAT Inc.) for over 4 years and the
IPC D-36 Subcommittee for over 2 years. This paper describes the initial motivation
.. read more
Applying Automation to the NPI Process
With the increase in outsourcing activity throughout the electronics industry,OEM’s are turning to Electronic
Manufacturing Services (EMS) to provide quality quick turn prototypes and fast New
.. read more
A Self Assessment Software Tool for SMT Processes and Productivity Optimization
Numerous studies and anecdotal data suggest that most SMT assembly lines are not optimized. This situation is true
whether one looks at the individual processes,such as stencil printing or plac
.. read more
Additively Manufactured Electronics Technology
On November 15, 2023, we provided an overview of Additively Manufactured Electronics (AME)—a technology that enables 3D printing of functional circuit boards and advanced electronic devices.
.. read more
Pb-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs
As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s
.. read more
Common Mistakes in Electronic Design
Board-level designers are constantly expected to cram more computational power,into a smaller space,at lower cost,and accomplish this task in less time and with fewer resources. In this rush to
.. read more
DFM Rules for Smartphones: An Analysis of Yield on Extremely Dense Assemblies
Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in pa
.. read more
Design for Manufacturability in Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. read more
Design for Manufacturability in the Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. read more
New Reinforcement Material can Solve Heat and Co-Efficient of Thermal Expansion Challenges of the Printed Circuit Board and IC Substrate
Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s
.. read more
Changing the Methodology for DFM Moving from Design-Checker to Interactive,Informed Design Methodologies
The phrase "Design For Manufacture" strongly implies the use of manufacturing information while making of design decisions or,in other words,incorporating manufacturing knowledge during initial
.. read more
A Case Study of an OEM's Program to Assess Supplier Capabilities,Technology Availability,and Reliability for Advanced Printed Circuit Boards
Teradyne,Inc. has been involved with Conductor Analysis Technologies,Inc. (CAT Inc.) for over 4 years and the
IPC D-36 Subcommittee for over 2 years. This paper describes the initial motivation
.. read more
Applying Automation to the NPI Process
With the increase in outsourcing activity throughout the electronics industry,OEM’s are turning to Electronic
Manufacturing Services (EMS) to provide quality quick turn prototypes and fast New
.. read more
A Self Assessment Software Tool for SMT Processes and Productivity Optimization
Numerous studies and anecdotal data suggest that most SMT assembly lines are not optimized. This situation is true
whether one looks at the individual processes,such as stencil printing or plac
.. read more