Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Moisture Effects on the High Frequency Testing of Laminates
Earlier HDP User Group project work that has been completed and published compared the different types of high frequency test methods used in the industry for measuring Dk and Df at high fre
.. read more
Development of Halogen Free,Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer
With the rapid development of the information industry,increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In
.. read more
Effect of Permittivity and Dissipation Factor of Solder Mask Upon Measured Loss
Existing coated microstrip trace impedance estimation usually uses the dielectric constant (Dk) of solder mask ink measured at 1 MHz from its datasheet. Or,some printed circuit board (PCB) manu
.. read more
A Signal Integrity Measuring Methodology in the Extraction of Wide Bandwidth Environmental Coefficients
In technology tendency,signal integrity performance gets more critical upon today’s higher signal transmission speed and quantity demand in every field of applications such as computer CPU and
.. read more
Insertion Loss Comparisons of Common High Frequency PCB Constructions
Printed Circuit Boards (PCB’s) have been used for many years in low loss,high frequency microwave applications and many of these circuits have become increasingly complex. Often these complex c
.. read more
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
.. read more
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
.. read more
New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
.. read more
Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards
The continuous progression toward portable,high frequency microelectronic systems has placed high demands on material
performance,notably low dielectric constants (Dk),low loss tangent (Df),low
.. read more
Step Stress Testing of Solid Tantalum Capacitors
Solid tantalum capacitors were introduced to the market more than five decades ago and continue to be widely used. Reliability issues arise when tantalum capacitors are exposed to excessive the
.. read more
iNEMI HFR-Free Signal Integrity Project: An Investigation to Identify Degradation of Electrical Signals in HFR-Free PCB Materials
Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 printed
circuit boards (PCB) have prompted market demand for HFR-free computer sy
.. read more
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. read more
Understanding when to use FR-4 laminates or High Frequency Laminates
Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has
.. read more
Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing
High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur
.. read more
Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor
Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l
.. read more
Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials
Printed circuit board laminate datasheets provide permittivity (dielectric constant,Dk) and loss tangent (dissipation factor,Df) values that are used for specification and board design. But pas
.. read more
Determining Dielectric Properties of High Frequency PCB Laminate Materials
This paper will focus on understanding the dielectric constant (dk) of high frequency laminate materials. The dissipation factor (df) and other electrical properties will be discussed as well,h
.. read more
Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
.. read more
Effect of Environmental Stress and Bias Conditions on Reliability of Embedded Planar Capacitors
The reliability of an embedded planar capacitor laminate under a variety of environmental stress and bias conditions was investigated. The dielectric consisted of a composite of BaTiO3 particle
.. read more
Polyphenylene Ether Macromonomers. Iii. Enhancement of Dielectric Materials
Two major trends in printed wiring boards electronics are applications that require higher operating frequency,often in the radio frequency range (GHz),and the use of lead free solder assembly.
.. read more
The Influence of Material Reactivity in Dk/Df Electrical Performance
Over the years,signal integrity performance and bandwidth gets more critical for today’s higher signal transmission speeds and bandwidth demand in every field of applications such as computing,
.. read more
Effect of Conductor Surface Roughness upon Measured Loss and Extracted Values of PCB Laminate Material Dissipation Factor
Prediction of accurate values for insertion loss (S21) on printed circuit boards has become ever more critical to SI modeling as signal speeds required for next-generation networking equipment
.. read more
Base Material Consideration for High Speed Printed Circuit boards
Over these years,EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trend,signal integrity performance gets more critical upon today’s h
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Comparative Study of Phosphorus-based Flame Retardants in Halogen-Free Laminates
This paper compares performance of two phosphorus-based flame retardants: poly-(m-phenylene methyl phosphonate) (PPMP) recently introduced to the market and 9,10-dihydro-9-oxa-10-phosphenanthre
.. read more
Dielectric Constant and Dissapation Factor of Fr4 Laminates Produced Using Specific Vendors of Fiberglass Yarn
Currently there is not a specification within the IPC for the DK and DF of E-Glass reinforcements and there is no
requirement to report the DK and DF of the glass formulation used to produce E-
.. read more
Novel Material having Low Transmission Loss and Low Thermal Expansion designed for High Frequency Multi-layer Printed Circuit Board Applications
A new multi-layer PCB (printed circuit board) having low transmission loss and low thermal expansion that meets up-coming
further high speed and high volume data transmission demands was develo
.. read more
Novel Polyimide Build-up Material for Fine-line Fabrication
We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount
high speed CPUs with high I/O numbers. These PWBs meet the following require
.. read more
Electrical Characteristics of High Speed Materials
This paper will discuss the two primary transmission components that concern designers today. These components affect the
signal integrity of all high-speed transmissions in printed circuit boa
.. read more
Moisture Effects on the High Frequency Testing of Laminates
Earlier HDP User Group project work that has been completed and published compared the different types of high frequency test methods used in the industry for measuring Dk and Df at high fre
.. read more
Development of Halogen Free,Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer
With the rapid development of the information industry,increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In
.. read more
Effect of Permittivity and Dissipation Factor of Solder Mask Upon Measured Loss
Existing coated microstrip trace impedance estimation usually uses the dielectric constant (Dk) of solder mask ink measured at 1 MHz from its datasheet. Or,some printed circuit board (PCB) manu
.. read more
A Signal Integrity Measuring Methodology in the Extraction of Wide Bandwidth Environmental Coefficients
In technology tendency,signal integrity performance gets more critical upon today’s higher signal transmission speed and quantity demand in every field of applications such as computer CPU and
.. read more
Insertion Loss Comparisons of Common High Frequency PCB Constructions
Printed Circuit Boards (PCB’s) have been used for many years in low loss,high frequency microwave applications and many of these circuits have become increasingly complex. Often these complex c
.. read more
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
.. read more
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
.. read more
New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
.. read more
Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards
The continuous progression toward portable,high frequency microelectronic systems has placed high demands on material
performance,notably low dielectric constants (Dk),low loss tangent (Df),low
.. read more
Step Stress Testing of Solid Tantalum Capacitors
Solid tantalum capacitors were introduced to the market more than five decades ago and continue to be widely used. Reliability issues arise when tantalum capacitors are exposed to excessive the
.. read more
iNEMI HFR-Free Signal Integrity Project: An Investigation to Identify Degradation of Electrical Signals in HFR-Free PCB Materials
Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 printed
circuit boards (PCB) have prompted market demand for HFR-free computer sy
.. read more
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. read more
Understanding when to use FR-4 laminates or High Frequency Laminates
Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has
.. read more
Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing
High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur
.. read more
Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor
Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l
.. read more
Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials
Printed circuit board laminate datasheets provide permittivity (dielectric constant,Dk) and loss tangent (dissipation factor,Df) values that are used for specification and board design. But pas
.. read more
Determining Dielectric Properties of High Frequency PCB Laminate Materials
This paper will focus on understanding the dielectric constant (dk) of high frequency laminate materials. The dissipation factor (df) and other electrical properties will be discussed as well,h
.. read more
Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
.. read more
Effect of Environmental Stress and Bias Conditions on Reliability of Embedded Planar Capacitors
The reliability of an embedded planar capacitor laminate under a variety of environmental stress and bias conditions was investigated. The dielectric consisted of a composite of BaTiO3 particle
.. read more
Polyphenylene Ether Macromonomers. Iii. Enhancement of Dielectric Materials
Two major trends in printed wiring boards electronics are applications that require higher operating frequency,often in the radio frequency range (GHz),and the use of lead free solder assembly.
.. read more
The Influence of Material Reactivity in Dk/Df Electrical Performance
Over the years,signal integrity performance and bandwidth gets more critical for today’s higher signal transmission speeds and bandwidth demand in every field of applications such as computing,
.. read more
Effect of Conductor Surface Roughness upon Measured Loss and Extracted Values of PCB Laminate Material Dissipation Factor
Prediction of accurate values for insertion loss (S21) on printed circuit boards has become ever more critical to SI modeling as signal speeds required for next-generation networking equipment
.. read more
Base Material Consideration for High Speed Printed Circuit boards
Over these years,EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trend,signal integrity performance gets more critical upon today’s h
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Comparative Study of Phosphorus-based Flame Retardants in Halogen-Free Laminates
This paper compares performance of two phosphorus-based flame retardants: poly-(m-phenylene methyl phosphonate) (PPMP) recently introduced to the market and 9,10-dihydro-9-oxa-10-phosphenanthre
.. read more
Dielectric Constant and Dissapation Factor of Fr4 Laminates Produced Using Specific Vendors of Fiberglass Yarn
Currently there is not a specification within the IPC for the DK and DF of E-Glass reinforcements and there is no
requirement to report the DK and DF of the glass formulation used to produce E-
.. read more
Novel Material having Low Transmission Loss and Low Thermal Expansion designed for High Frequency Multi-layer Printed Circuit Board Applications
A new multi-layer PCB (printed circuit board) having low transmission loss and low thermal expansion that meets up-coming
further high speed and high volume data transmission demands was develo
.. read more
Novel Polyimide Build-up Material for Fine-line Fabrication
We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount
high speed CPUs with high I/O numbers. These PWBs meet the following require
.. read more
Electrical Characteristics of High Speed Materials
This paper will discuss the two primary transmission components that concern designers today. These components affect the
signal integrity of all high-speed transmissions in printed circuit boa
.. read more