Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Brave New World of PCB Design Validation – Cloud-Based DFM and Collaboration
Today’s electronics industry is grappling with increasing demand for more customized products, shorter development cycles, supply chain disruptions, and tighter margins. In the PCB manufactu
.. read more
AI-Based Design for Manufacturing in Selective Wave Soldering
The soldering of THT components through solder waves is a thermal process. However, current design rules, guidelines and guideline catalogs do not map the soldering heat requirement of a sol
.. read more
A New Paradigm for Design through Manufacture
Working through the New Product Introduction (NPI) flow between the product design and manufacturing is usually a challenging process,with both parties being experts in their own fields and ine
.. read more
Common Mistakes in Electronic Design
Board-level designers are constantly expected to cram more computational power,into a smaller space,at lower cost,and accomplish this task in less time and with fewer resources. In this rush to
.. read more
DFM Rules for Smartphones: An Analysis of Yield on Extremely Dense Assemblies
Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in pa
.. read more
Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications
Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde
.. read more
Design for Manufacturability in Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. read more
Design Environment ROI: How Design Teams On a Budget Can Build a Best in Class Design Environment
Design workflow is the core to your design team?s competitive advantage; it?s the conduit by which you turn your team?s expertise and ideas into manufacturable products. And yet,all engineering
.. read more
Changing the Methodology for DFM Moving from Design-Checker to Interactive,Informed Design Methodologies
The phrase "Design For Manufacture" strongly implies the use of manufacturing information while making of design decisions or,in other words,incorporating manufacturing knowledge during initial
.. read more
Design for Manufacturability in the Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. read more
New Reinforcement Material can Solve Heat and Co-Efficient of Thermal Expansion Challenges of the Printed Circuit Board and IC Substrate
Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s
.. read more
Implementing Pb-Free Process
European directive2002/95/EC (RoHS) bans the use of several substances for electronic assemblies by July 2006. These
regulations have a great impact on the Electronic Packaging and Interconnect
.. read more
VIGOR European Project New Industrial Applications in 3-D Interconnection
The 3-D interconnection and packaging emerged from the last decade. Today,the 3-D interconnection technologies are
becoming mature and their reliability assessed. 3-D technology constitutes the
.. read more
EMS/OEM Interaction: Maximizing Benefit by Optimizing Communication
The relationship between the OEM and the EMS provider (Electronic Manufacturing Services) has evolved with the
increase in outsourcing of manufacturing services. This has resulted in the conseq
.. read more
Applying Automation to the NPI Process
With the increase in outsourcing activity throughout the electronics industry,OEM’s are turning to Electronic
Manufacturing Services (EMS) to provide quality quick turn prototypes and fast New
.. read more
A Self Assessment Software Tool for SMT Processes and Productivity Optimization
Numerous studies and anecdotal data suggest that most SMT assembly lines are not optimized. This situation is true
whether one looks at the individual processes,such as stencil printing or plac
.. read more
The Brave New World of PCB Design Validation – Cloud-Based DFM and Collaboration
Today’s electronics industry is grappling with increasing demand for more customized products, shorter development cycles, supply chain disruptions, and tighter margins. In the PCB manufactu
.. read more
AI-Based Design for Manufacturing in Selective Wave Soldering
The soldering of THT components through solder waves is a thermal process. However, current design rules, guidelines and guideline catalogs do not map the soldering heat requirement of a sol
.. read more
A New Paradigm for Design through Manufacture
Working through the New Product Introduction (NPI) flow between the product design and manufacturing is usually a challenging process,with both parties being experts in their own fields and ine
.. read more
Common Mistakes in Electronic Design
Board-level designers are constantly expected to cram more computational power,into a smaller space,at lower cost,and accomplish this task in less time and with fewer resources. In this rush to
.. read more
DFM Rules for Smartphones: An Analysis of Yield on Extremely Dense Assemblies
Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in pa
.. read more
Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications
Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde
.. read more
Design for Manufacturability in Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. read more
Design Environment ROI: How Design Teams On a Budget Can Build a Best in Class Design Environment
Design workflow is the core to your design team?s competitive advantage; it?s the conduit by which you turn your team?s expertise and ideas into manufacturable products. And yet,all engineering
.. read more
Changing the Methodology for DFM Moving from Design-Checker to Interactive,Informed Design Methodologies
The phrase "Design For Manufacture" strongly implies the use of manufacturing information while making of design decisions or,in other words,incorporating manufacturing knowledge during initial
.. read more
Design for Manufacturability in the Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. read more
New Reinforcement Material can Solve Heat and Co-Efficient of Thermal Expansion Challenges of the Printed Circuit Board and IC Substrate
Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s
.. read more
Implementing Pb-Free Process
European directive2002/95/EC (RoHS) bans the use of several substances for electronic assemblies by July 2006. These
regulations have a great impact on the Electronic Packaging and Interconnect
.. read more
VIGOR European Project New Industrial Applications in 3-D Interconnection
The 3-D interconnection and packaging emerged from the last decade. Today,the 3-D interconnection technologies are
becoming mature and their reliability assessed. 3-D technology constitutes the
.. read more
EMS/OEM Interaction: Maximizing Benefit by Optimizing Communication
The relationship between the OEM and the EMS provider (Electronic Manufacturing Services) has evolved with the
increase in outsourcing of manufacturing services. This has resulted in the conseq
.. read more
Applying Automation to the NPI Process
With the increase in outsourcing activity throughout the electronics industry,OEM’s are turning to Electronic
Manufacturing Services (EMS) to provide quality quick turn prototypes and fast New
.. read more
A Self Assessment Software Tool for SMT Processes and Productivity Optimization
Numerous studies and anecdotal data suggest that most SMT assembly lines are not optimized. This situation is true
whether one looks at the individual processes,such as stencil printing or plac
.. read more