Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Thermally Conductive, EMI Shielding Materials for High Frequency Radio Waves
Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniatu
.. read more
Influence of Copper Conductor Surface Treatment for High Reliability PCB on Electrical Properties and Reliability
Development of information and the telecommunications network has been outstanding in recent years,and it is required for the related equipment such as communication base stations,servers and r
.. read more
High Frequency Dk and Df Test Methods Comparison High Density User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods,wi
.. read more
The Effects of PCB Fabrication on High-Frequency Electrical Performance
Achieving optimum high-frequency printed-circuit-board (PCB) performance is not simply a matter of specifying the best possible PCB material,but can be significantly impacted by PCB fabrication
.. read more
Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
.. read more
Insertion Loss Comparisons of Common High Frequency PCB Constructions
Printed Circuit Boards (PCB’s) have been used for many years in low loss,high frequency microwave applications and many of these circuits have become increasingly complex. Often these complex c
.. read more
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. read more
Polyphenylene Ether Macromonomer. Viii. Low Z-Axis Cte,Low Df Epoxy Laminates
Properties of printed circuit board laminates are a function of the type and levels of its components. Endeavors to a balance various performance criteria involve balancing the types and amount
.. read more
Effect of Conductor Surface Roughness upon Measured Loss and Extracted Values of PCB Laminate Material Dissipation Factor
Prediction of accurate values for insertion loss (S21) on printed circuit boards has become ever more critical to SI modeling as signal speeds required for next-generation networking equipment
.. read more
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate) which exhibits an extremely low transmission loss at mm-wave band. The CCL which we developed is based on a new fluoropolymer with adhesiv
.. read more
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Humidity-Dependent Loss in PCB Substrates
Increasing operating frequency of IO busses for computing has highlighted the importance of transmission line loss. For FR4 PCB mother boards computing at speeds above 1 GHz this is dominated b
.. read more
AFFORDABLE MICROWAVE CIRCUIT BOARD SUBSTRATE MATERIAL
While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss. Cyclic olefin copolymer fibers have a lower dielectric constant and los
.. read more
Solution Processed High Capacitance Nanocomposite Dielectric for Printed Electronics Applications
Since early last decade,scientists had succeeded in applying printing-related technologies to create organic field
effect transistors (OFETs) with micron-sized features. This has led to a wide-
.. read more
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
.. read more
Novel Polyimide Build-up Material for Fine-line Fabrication
We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount
high speed CPUs with high I/O numbers. These PWBs meet the following require
.. read more
Thermally Conductive, EMI Shielding Materials for High Frequency Radio Waves
Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniatu
.. read more
Influence of Copper Conductor Surface Treatment for High Reliability PCB on Electrical Properties and Reliability
Development of information and the telecommunications network has been outstanding in recent years,and it is required for the related equipment such as communication base stations,servers and r
.. read more
High Frequency Dk and Df Test Methods Comparison High Density User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods,wi
.. read more
The Effects of PCB Fabrication on High-Frequency Electrical Performance
Achieving optimum high-frequency printed-circuit-board (PCB) performance is not simply a matter of specifying the best possible PCB material,but can be significantly impacted by PCB fabrication
.. read more
Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
.. read more
Insertion Loss Comparisons of Common High Frequency PCB Constructions
Printed Circuit Boards (PCB’s) have been used for many years in low loss,high frequency microwave applications and many of these circuits have become increasingly complex. Often these complex c
.. read more
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. read more
Polyphenylene Ether Macromonomer. Viii. Low Z-Axis Cte,Low Df Epoxy Laminates
Properties of printed circuit board laminates are a function of the type and levels of its components. Endeavors to a balance various performance criteria involve balancing the types and amount
.. read more
Effect of Conductor Surface Roughness upon Measured Loss and Extracted Values of PCB Laminate Material Dissipation Factor
Prediction of accurate values for insertion loss (S21) on printed circuit boards has become ever more critical to SI modeling as signal speeds required for next-generation networking equipment
.. read more
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate) which exhibits an extremely low transmission loss at mm-wave band. The CCL which we developed is based on a new fluoropolymer with adhesiv
.. read more
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Humidity-Dependent Loss in PCB Substrates
Increasing operating frequency of IO busses for computing has highlighted the importance of transmission line loss. For FR4 PCB mother boards computing at speeds above 1 GHz this is dominated b
.. read more
AFFORDABLE MICROWAVE CIRCUIT BOARD SUBSTRATE MATERIAL
While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss. Cyclic olefin copolymer fibers have a lower dielectric constant and los
.. read more
Solution Processed High Capacitance Nanocomposite Dielectric for Printed Electronics Applications
Since early last decade,scientists had succeeded in applying printing-related technologies to create organic field
effect transistors (OFETs) with micron-sized features. This has led to a wide-
.. read more
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
.. read more
Novel Polyimide Build-up Material for Fine-line Fabrication
We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount
high speed CPUs with high I/O numbers. These PWBs meet the following require
.. read more