Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effects of Dielectric Material,Aspect Ratio and Copper Plating on Microvia Reliability
This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp
.. read more
Development of High Density Wiring Technology and Interconnect Technology with Silicon Through-Hole
We have developed the copper high density wiring formation technology with Cu/photosensitive Benzocyclobutene (BCB) as
a dielectric material,and interconnect technology with Silicon through-hol
.. read more
High Frequency Conductor Loss Impact of Oxide and Oxide Alternative Processes
In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the
dominate factor. Material selection,trace geometry,and choice of coppe
.. read more
Effects of Dielectric Material,Aspect Ratio and Copper Plating on Microvia Reliability
This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp
.. read more
Development of High Density Wiring Technology and Interconnect Technology with Silicon Through-Hole
We have developed the copper high density wiring formation technology with Cu/photosensitive Benzocyclobutene (BCB) as
a dielectric material,and interconnect technology with Silicon through-hol
.. read more
High Frequency Conductor Loss Impact of Oxide and Oxide Alternative Processes
In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the
dominate factor. Material selection,trace geometry,and choice of coppe
.. read more