Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Novel Material for High Layer Count and High Reliability Printed Circuit Boards
Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of
withstanding Pb-free soldering processes used in the assembly of RoHS comp
.. read more
Printable Materials and Devices
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology.
.. read more
A Novel Thermal Material for Multi-Layer Metal Core Printed Circuit Boards
Today,the metal core printed circuit board (MCPCB) business is booming thanks to the rising popularity of LED TV. The majority of MCPCB is single sided. However,the demand for multi-layer board
.. read more
Determining Dielectric Properties of High Frequency PCB Laminate Materials
This paper will focus on understanding the dielectric constant (dk) of high frequency laminate materials. The dissipation factor (df) and other electrical properties will be discussed as well,h
.. read more
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
.. read more
Polyphenylene Ether Macromonomers. Iii. Enhancement of Dielectric Materials
Two major trends in printed wiring boards electronics are applications that require higher operating frequency,often in the radio frequency range (GHz),and the use of lead free solder assembly.
.. read more
The Influence of Material Reactivity in Dk/Df Electrical Performance
Over the years,signal integrity performance and bandwidth gets more critical for today’s higher signal transmission speeds and bandwidth demand in every field of applications such as computing,
.. read more
Environmentally Friendly Low Transmission Loss Base/Multilayer Materials
The frequencies used to communicate and process information have been extended beyond the GHz band to the microwave
band to handle the growing volume of data. Moreover,increasing global interes
.. read more
3-Dimensional Partitioning of Printed Circuit Design for High Speed Interconnections
When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact
signal integrity at high data rates including: inconsistencies in dielectri
.. read more
Insulation Material for Next Generation Packaging Substrates
With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor
devices are required to cope with finer patterning and higher wiring densi
.. read more
Laminate Materials with Low Dielectric Properties
Wireless Communications and Broadband technologies are driving the need for advanced laminate materials with
improved dielectric properties. This paper focuses on new laminate materials with po
.. read more
A Novel Material for High Layer Count and High Reliability Printed Circuit Boards
Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of
withstanding Pb-free soldering processes used in the assembly of RoHS comp
.. read more
Printable Materials and Devices
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology.
.. read more
A Novel Thermal Material for Multi-Layer Metal Core Printed Circuit Boards
Today,the metal core printed circuit board (MCPCB) business is booming thanks to the rising popularity of LED TV. The majority of MCPCB is single sided. However,the demand for multi-layer board
.. read more
Determining Dielectric Properties of High Frequency PCB Laminate Materials
This paper will focus on understanding the dielectric constant (dk) of high frequency laminate materials. The dissipation factor (df) and other electrical properties will be discussed as well,h
.. read more
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
.. read more
Polyphenylene Ether Macromonomers. Iii. Enhancement of Dielectric Materials
Two major trends in printed wiring boards electronics are applications that require higher operating frequency,often in the radio frequency range (GHz),and the use of lead free solder assembly.
.. read more
The Influence of Material Reactivity in Dk/Df Electrical Performance
Over the years,signal integrity performance and bandwidth gets more critical for today’s higher signal transmission speeds and bandwidth demand in every field of applications such as computing,
.. read more
Environmentally Friendly Low Transmission Loss Base/Multilayer Materials
The frequencies used to communicate and process information have been extended beyond the GHz band to the microwave
band to handle the growing volume of data. Moreover,increasing global interes
.. read more
3-Dimensional Partitioning of Printed Circuit Design for High Speed Interconnections
When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact
signal integrity at high data rates including: inconsistencies in dielectri
.. read more
Insulation Material for Next Generation Packaging Substrates
With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor
devices are required to cope with finer patterning and higher wiring densi
.. read more
Laminate Materials with Low Dielectric Properties
Wireless Communications and Broadband technologies are driving the need for advanced laminate materials with
improved dielectric properties. This paper focuses on new laminate materials with po
.. read more