Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards
Glass offers a number of advantages as a dielectric material,such as a low coefficient of thermal expansion (CTE),high dimensional stability,high thermal conductivity and suitable dielectric co
.. read more
Microwave Characteristics and Applications of Liquid Crystal Polymer Flex
We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol
.. read more
Use of Novel Adhesive-lined CCL Material in Single-pressed Multi-layer Circuit Boards with Inner Via-Holes in all Layers
This newly developed material and process enable the manufacturing,using a single pressing process,of multi-layer circuit
boards with inner via-holes in every layer. Because this material utili
.. read more
X-Y Scaling Compensation Technology for Fine-Line PCB Imaging with High-Precision Alignment
As imaging requirements continue to move towards finer resolution,accurate layer-to-layer alignment becomes an increasingly important factor that influences product yield. One of the major cont
.. read more
Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards
Glass offers a number of advantages as a dielectric material,such as a low coefficient of thermal expansion (CTE),high dimensional stability,high thermal conductivity and suitable dielectric co
.. read more
Microwave Characteristics and Applications of Liquid Crystal Polymer Flex
We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol
.. read more
Use of Novel Adhesive-lined CCL Material in Single-pressed Multi-layer Circuit Boards with Inner Via-Holes in all Layers
This newly developed material and process enable the manufacturing,using a single pressing process,of multi-layer circuit
boards with inner via-holes in every layer. Because this material utili
.. read more
X-Y Scaling Compensation Technology for Fine-Line PCB Imaging with High-Precision Alignment
As imaging requirements continue to move towards finer resolution,accurate layer-to-layer alignment becomes an increasingly important factor that influences product yield. One of the major cont
.. read more