Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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The Next RF Probing Challenge: IoT and 5G

IoT and 5G applications have theirchallenges when it comes to functional testing –especially for the probing part inside a functional test fixture(hereinafter referred to as “FCT” fixture).I .. read more

Functional Test on RF And High-Speed Connectors on PCBA's And Cable Harness Assemblies for Automotive Applications

This paper presents test methods to effectively perform conducted testing on RF and high-speed data connectors for automotive applications. In almost any modern vehicle there are numerous hi .. read more

Evaluating Solder Joint Failures and Solder Joint Reliability: A Side-by-Side Comparison of Direct Current and Microwave Based Monitoring Techniques

Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circ .. read more

The Next RF Probing Challenge: IoT and 5G

IoT and 5G applications have theirchallenges when it comes to functional testing –especially for the probing part inside a functional test fixture(hereinafter referred to as “FCT” fixture).I .. read more

Functional Test on RF And High-Speed Connectors on PCBA's And Cable Harness Assemblies for Automotive Applications

This paper presents test methods to effectively perform conducted testing on RF and high-speed data connectors for automotive applications. In almost any modern vehicle there are numerous hi .. read more

Evaluating Solder Joint Failures and Solder Joint Reliability: A Side-by-Side Comparison of Direct Current and Microwave Based Monitoring Techniques

Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circ .. read more