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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Microvia Weak Interfacial Fracture of Microvia Designs-Comparing the Reliability of Graphite-based Direct Metallization and Conventional Electroless Copper-Phase 1
Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface betwee
.. read more
The Total Environmental Solution For Any-Layer HDI Production
Copper Via-Fill application in acid copper plating of PWB is experiencing a significant growth due to the booming of smartphone and tablet PC. With this growth,the PC board demand of HDI comple
.. read more
'Bridging the Gap’ – Technical Capabilities of a Direct Plate PTH Process
In contrast to electroless copper,direct metallization processes are inherently less expensive to operate,more environmental
friendly,requires less floor space and are more efficient. Among the
.. read more
PTFE Wettability for Electroless Copper and Direct Metallization
PTFE material is very hydrophobic and among the most difficult to deposit electroless copper or direct metallization. These
materials have very low friction,which makes a surface non-wettable.
.. read more
Reengineered Conductive Polymers - The PTH Alternative to Electroless Copper for HDI Mass Production
In many areas conductive polymers have already gained full acceptance as a reliable and qualitatively outstanding metallization process and as a true competitor for electroless Cu. In the paper
.. read more
Microvia Weak Interfacial Fracture of Microvia Designs-Comparing the Reliability of Graphite-based Direct Metallization and Conventional Electroless Copper-Phase 1
Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface betwee
.. read more
The Total Environmental Solution For Any-Layer HDI Production
Copper Via-Fill application in acid copper plating of PWB is experiencing a significant growth due to the booming of smartphone and tablet PC. With this growth,the PC board demand of HDI comple
.. read more
'Bridging the Gap’ – Technical Capabilities of a Direct Plate PTH Process
In contrast to electroless copper,direct metallization processes are inherently less expensive to operate,more environmental
friendly,requires less floor space and are more efficient. Among the
.. read more
PTFE Wettability for Electroless Copper and Direct Metallization
PTFE material is very hydrophobic and among the most difficult to deposit electroless copper or direct metallization. These
materials have very low friction,which makes a surface non-wettable.
.. read more
Reengineered Conductive Polymers - The PTH Alternative to Electroless Copper for HDI Mass Production
In many areas conductive polymers have already gained full acceptance as a reliable and qualitatively outstanding metallization process and as a true competitor for electroless Cu. In the paper
.. read more