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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints
Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu
.. read more
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. read more
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints
Prior to committing production boards to vapor phase soldering,we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor phase processe
.. read more
Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so
.. read more
Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints
Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu
.. read more
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. read more
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints
Prior to committing production boards to vapor phase soldering,we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor phase processe
.. read more
Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so
.. read more