Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Concentration Monitoring & Closed Loop Control – Phase 2
Historically,the determination of the concentration of cleaning agent in high precision electronic cleaning baths has depended on any one of several possible measurable parameters. Refractive I
.. read more
Combination of Spray and Soak Improves Cleaning under Bottom Terminations
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller c
.. read more
Printed Circuit Board Fabrication Processes and Their Effects on Fine Copper Barrel Cracks
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects,the causes of copper barrel cracks in printe
.. read more
An Investigation into Printing Miniaturised Devices for the Automotive and Industrial Manufacturing Sectors
The electronics market is divided into many segments each having its own challenges; but one theme that connects the electronics community together is a need for higher yield with lower costs.
.. read more
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa
.. read more
Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
.. read more
Using DMAIC Methodology for MLP Reflow Process Optimization
The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the
.. read more
New Improved Polyimides for Increased Reliability
A Design of Experiment (DOE) was conducted to determine the best filler,or combination of fillers that would offer the best
reduction of CTE expansion from 50oC to 260o C without compromising e
.. read more
End-of-Life Management of Electronics Products Through Functional Signature Analysis
This paper presents a functional signature analysis method for the end-of-life management of products,particularly for
electrical-electronics and electromechanical applications.
Due to the fast
.. read more
Wave Solder Process Optimization for Complex Electronic Assemblies: A Design of Experiments Approach
Numerous technical articles have dealt with machine parameters,and their effect on wave soldering of Printed Circuit Boards
in the range of 40-93 mils and the typical 6 to 8 layers. This resear
.. read more
Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing
The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout
the electronics supply chain. The University of Massachusetts Lowell has bro
.. read more
Solder Paste Wetting and Solder-Balling Evaluation: A Quantitative Statistical Approach Using DOE
The ability of a solder paste particles to coalesce and wet the Printed Wiring Board (PWB) and component lead is
key to proper solder joint formation. Robust solder paste performance is needed
.. read more
A Self Assessment Software Tool for SMT Processes and Productivity Optimization
Numerous studies and anecdotal data suggest that most SMT assembly lines are not optimized. This situation is true
whether one looks at the individual processes,such as stencil printing or plac
.. read more
Component Specific PCB Registration Characterization
Predicting printed circuit board (PCB) thickness has not historically been a difficult task. With lower layer count
boards you can afford for the prediction per layer to be wrong by a relativel
.. read more
Concentration Monitoring & Closed Loop Control – Phase 2
Historically,the determination of the concentration of cleaning agent in high precision electronic cleaning baths has depended on any one of several possible measurable parameters. Refractive I
.. read more
Combination of Spray and Soak Improves Cleaning under Bottom Terminations
The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller c
.. read more
Printed Circuit Board Fabrication Processes and Their Effects on Fine Copper Barrel Cracks
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects,the causes of copper barrel cracks in printe
.. read more
An Investigation into Printing Miniaturised Devices for the Automotive and Industrial Manufacturing Sectors
The electronics market is divided into many segments each having its own challenges; but one theme that connects the electronics community together is a need for higher yield with lower costs.
.. read more
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa
.. read more
Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
.. read more
Using DMAIC Methodology for MLP Reflow Process Optimization
The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the
.. read more
New Improved Polyimides for Increased Reliability
A Design of Experiment (DOE) was conducted to determine the best filler,or combination of fillers that would offer the best
reduction of CTE expansion from 50oC to 260o C without compromising e
.. read more
End-of-Life Management of Electronics Products Through Functional Signature Analysis
This paper presents a functional signature analysis method for the end-of-life management of products,particularly for
electrical-electronics and electromechanical applications.
Due to the fast
.. read more
Wave Solder Process Optimization for Complex Electronic Assemblies: A Design of Experiments Approach
Numerous technical articles have dealt with machine parameters,and their effect on wave soldering of Printed Circuit Boards
in the range of 40-93 mils and the typical 6 to 8 layers. This resear
.. read more
Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing
The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout
the electronics supply chain. The University of Massachusetts Lowell has bro
.. read more
Solder Paste Wetting and Solder-Balling Evaluation: A Quantitative Statistical Approach Using DOE
The ability of a solder paste particles to coalesce and wet the Printed Wiring Board (PWB) and component lead is
key to proper solder joint formation. Robust solder paste performance is needed
.. read more
A Self Assessment Software Tool for SMT Processes and Productivity Optimization
Numerous studies and anecdotal data suggest that most SMT assembly lines are not optimized. This situation is true
whether one looks at the individual processes,such as stencil printing or plac
.. read more
Component Specific PCB Registration Characterization
Predicting printed circuit board (PCB) thickness has not historically been a difficult task. With lower layer count
boards you can afford for the prediction per layer to be wrong by a relativel
.. read more