Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop Shock Resistance
DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock pe
.. read more
Full Material Declarations: Removing Barriers to Environmental Data Reporting
Since the European Directives,RoHS (Restriction of Hazardous Substances) and REACH (Registration,Evaluation,Authorization and Restriction of Chemicals),entered into force in 2006-7,the number o
.. read more
Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloy BGA Assembly
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study,BGAs with SAC105,SAC305,and BiSnAg balls were assembled with SAC105,SAC305 or 57Bi4
.. read more
Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution
During the last 5 years,the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new meth
.. read more
A Compliant and Creep Resistant SAC-Al (Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. read more
Performing Flux-Technology for Pb-Free SN100C Solders
SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol
.. read more
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Describing Key Coating and Process Characteristics of a Pb-Free OSP Process
Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more
Characterization of the Thermal Stability of Electrical Laminates Suitable for Lead-Free Soldering
Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. As an exa
.. read more
The Effect of Ni on the Microstructure and Behaviour of the Sn-Cu Eutectic Lead-free Solder
While the Ni-stabilized Sn-0.7Cu alloy is now well established as a viable lead-free solder in large scale commercial printed
circuit board assembly the effect of Ni is not yet fully understood
.. read more
Conquer Tombstoning in Lead-Free Soldering
Tombstoning of SnAgCu is affected by the solder composition. At vapor phase soldering,both wetting force and wetting
time at a temperature well above the melting point have no correlation with
.. read more
The Importance of Cooling Rate in the Developing the Totally Controlled Reflow Process for Lead Free and Eutectic Tin Lead...
The impact cooling rates exert on the reflow process is identified. The trends in shear strength and the
microstructural evolution of the solder joints are described. Lead free (Sn/3.5Ag/0.7Cu)
.. read more
Application of Thermal Analysis Techniques to Determine Performance Entitlement of Base Materials through Assembly
Multiple soldering assembly steps are essentially
standard for PWBs based on current technologies and
needs. A variety of tests are currently in use to
evaluate the performance of finished PWBs
.. read more
A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop Shock Resistance
DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock pe
.. read more
Full Material Declarations: Removing Barriers to Environmental Data Reporting
Since the European Directives,RoHS (Restriction of Hazardous Substances) and REACH (Registration,Evaluation,Authorization and Restriction of Chemicals),entered into force in 2006-7,the number o
.. read more
Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloy BGA Assembly
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study,BGAs with SAC105,SAC305,and BiSnAg balls were assembled with SAC105,SAC305 or 57Bi4
.. read more
Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution
During the last 5 years,the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new meth
.. read more
A Compliant and Creep Resistant SAC-Al (Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. read more
Performing Flux-Technology for Pb-Free SN100C Solders
SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol
.. read more
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Describing Key Coating and Process Characteristics of a Pb-Free OSP Process
Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more
Characterization of the Thermal Stability of Electrical Laminates Suitable for Lead-Free Soldering
Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. As an exa
.. read more
The Effect of Ni on the Microstructure and Behaviour of the Sn-Cu Eutectic Lead-free Solder
While the Ni-stabilized Sn-0.7Cu alloy is now well established as a viable lead-free solder in large scale commercial printed
circuit board assembly the effect of Ni is not yet fully understood
.. read more
Conquer Tombstoning in Lead-Free Soldering
Tombstoning of SnAgCu is affected by the solder composition. At vapor phase soldering,both wetting force and wetting
time at a temperature well above the melting point have no correlation with
.. read more
The Importance of Cooling Rate in the Developing the Totally Controlled Reflow Process for Lead Free and Eutectic Tin Lead...
The impact cooling rates exert on the reflow process is identified. The trends in shear strength and the
microstructural evolution of the solder joints are described. Lead free (Sn/3.5Ag/0.7Cu)
.. read more
Application of Thermal Analysis Techniques to Determine Performance Entitlement of Base Materials through Assembly
Multiple soldering assembly steps are essentially
standard for PWBs based on current technologies and
needs. A variety of tests are currently in use to
evaluate the performance of finished PWBs
.. read more