Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Interconnect Reliability Correlation with System Design and Transportation Stress
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping c
.. read more
The Gap Dilemma in the Technical Cleanliness of Electronic Assemblies – Why Foreign Object Debris on Electronic Assemblies is not...
Technical Cleanliness, i.e., the quantification, control and mitigation of deleterious effects of foreign object debris (FOD), is a common challenge in engineering. In the context of electro
.. read more
Impact of Dust on Printed Circuit Assembly Reliability
Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials,water soluble salts,organic materials,and a sma
.. read more
Development of Cleanliness Specification for Single - Mode Connectors
This paper summarizes research performed by the NEMI (National Electronics Manufacturing Initiative) Fiber Optic Signal
Performance Project team. The project focused on the development of a cle
.. read more
Interconnect Reliability Correlation with System Design and Transportation Stress
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping c
.. read more
The Gap Dilemma in the Technical Cleanliness of Electronic Assemblies – Why Foreign Object Debris on Electronic Assemblies is not...
Technical Cleanliness, i.e., the quantification, control and mitigation of deleterious effects of foreign object debris (FOD), is a common challenge in engineering. In the context of electro
.. read more
Impact of Dust on Printed Circuit Assembly Reliability
Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials,water soluble salts,organic materials,and a sma
.. read more
Development of Cleanliness Specification for Single - Mode Connectors
This paper summarizes research performed by the NEMI (National Electronics Manufacturing Initiative) Fiber Optic Signal
Performance Project team. The project focused on the development of a cle
.. read more