Knowledge Hub

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Controlling Recrystallisation in Plated Layers Through the Use of Additives

This work compares the influence of a plating additive that has been applied to a commercially available electroless copper system and how its use impacts the morphology of the overall final .. read more

A Microvia Damage Model

An electrical model of a thermally damaged microvia has been constructed incorporating observations from electrical test, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy .. read more

High Resolution Physical Analyses of Microvia - Target Pad Interfaces

Open circuit failure in microvias is an important issue for critical device reliability yet remains poorly understood. Separations at the microvia-target pad interface caused by board-normal .. read more

Controlling Recrystallisation in Plated Layers Through the Use of Additives

This work compares the influence of a plating additive that has been applied to a commercially available electroless copper system and how its use impacts the morphology of the overall final .. read more

A Microvia Damage Model

An electrical model of a thermally damaged microvia has been constructed incorporating observations from electrical test, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy .. read more

High Resolution Physical Analyses of Microvia - Target Pad Interfaces

Open circuit failure in microvias is an important issue for critical device reliability yet remains poorly understood. Separations at the microvia-target pad interface caused by board-normal .. read more