Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Novel Surface Finish for 5G-mmWave frequency PCB Technologies- How to Achieve Optimum Signal Integrity
The next generation devices using high frequency of 5G to mmWave and greater has called for innovation in materials used in electronics manufacturing to realize the optimum signal integrity
.. read more
Reassessing Surface Finish Performance for Next Generation Technology
PCB Fabricators have long since abandoned Hot-Air Levelling, with several alternative final finishes (ImAg, ImSn, OSP, ENIG and ENEPIG) now well established as having a track record of meeti
.. read more
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. EPIG, electroless palladium immersion gold, is a new
.. read more
Novel Surface Finish for 5G-mmWave frequency PCB Technologies- How to Achieve Optimum Signal Integrity
The next generation devices using high frequency of 5G to mmWave and greater has called for innovation in materials used in electronics manufacturing to realize the optimum signal integrity
.. read more
Reassessing Surface Finish Performance for Next Generation Technology
PCB Fabricators have long since abandoned Hot-Air Levelling, with several alternative final finishes (ImAg, ImSn, OSP, ENIG and ENEPIG) now well established as having a track record of meeti
.. read more
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. EPIG, electroless palladium immersion gold, is a new
.. read more