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Influence of Salt Residues on BGA Head in Pillow
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides,in corrosion studies,the r
.. read more
TOF SIMS Analysis for SnxOy Determination on Lead-Free HASL PCB’s
During the production of Lead-Free Hot Air Solder Leveling (LF HASL),non-wetting issues in several components were found including BGA pad. The common visual aspect of the suspicious pads was t
.. read more
Impregnation of Metal Complex into Epoxy Insulation Materials Using Supercritical Carbon Dioxide and Its Application for Copper Plating
Metal plating of epoxy polymer has been widely applied for industrial products for a long time,especially in the field of Printed Circuit Boards (PCB’s). This technique is one of the most impor
.. read more
Drop Testing of a Pb-Free Board after Assembly and SnPb-Rework
•Board-level drop shock test was performed on 9 assemblies
–63 parts / board
–Parts representative of military package styles
•Assembled on Pb-free compatible laminate with SAC 305 solder
•Sele
.. read more
Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging
The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface
.. read more
A Compliant and Creep Resistant SAC-Al (Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. read more
Black Pad and Revisiting Methodologies
Society today relies on electronic devices that influence every aspect of our lives,such as communication,transportation,computing,home appliances,and recreation. The reliability of any electro
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
Experience in Processing EEE Components with Pure Electroplated Tin Leads As a
The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more
Influence of Salt Residues on BGA Head in Pillow
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides,in corrosion studies,the r
.. read more
TOF SIMS Analysis for SnxOy Determination on Lead-Free HASL PCB’s
During the production of Lead-Free Hot Air Solder Leveling (LF HASL),non-wetting issues in several components were found including BGA pad. The common visual aspect of the suspicious pads was t
.. read more
Impregnation of Metal Complex into Epoxy Insulation Materials Using Supercritical Carbon Dioxide and Its Application for Copper Plating
Metal plating of epoxy polymer has been widely applied for industrial products for a long time,especially in the field of Printed Circuit Boards (PCB’s). This technique is one of the most impor
.. read more
Drop Testing of a Pb-Free Board after Assembly and SnPb-Rework
•Board-level drop shock test was performed on 9 assemblies
–63 parts / board
–Parts representative of military package styles
•Assembled on Pb-free compatible laminate with SAC 305 solder
•Sele
.. read more
Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging
The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface
.. read more
A Compliant and Creep Resistant SAC-Al (Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. read more
Black Pad and Revisiting Methodologies
Society today relies on electronic devices that influence every aspect of our lives,such as communication,transportation,computing,home appliances,and recreation. The reliability of any electro
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
Experience in Processing EEE Components with Pure Electroplated Tin Leads As a
The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more