Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Realization of a New Concept for Power Chip Embedding
Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top
.. read more
New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
.. read more
A Designed Experiment for the Influence of Copper Foils on Impedance,DC Line Resistance and Insertion Loss
For the last couple of years,the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently,the need to reduce insertion loss came
.. read more
Understanding when to use FR-4 laminates or High Frequency Laminates
Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has
.. read more
PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems
For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
.. read more
High Frequency Circuit Materials used in the PCB Industry
Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There are several attributes of these materials that are very unique wh
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Effects of Adhesion Promotion Treatment On Electrical Signal Attenuation
Oxide alternatives,as well as traditional and reduced oxide chemistries,are coatings or “adhesion promoters” used to enhance the bond between imaged and etched inner layer copper surfaces and t
.. read more
Using Embedded Capacitance to Improve Electrical Performance,Eliminate Capacitors and Reduce Board Size In High Speed Digital and RF Applications
The global electronics industry is exhibiting a widespread and growing interest in the technology of embedded passives. This interest can be attributed to three primary benefits. First,embedded
.. read more
Ribbon Bonding For RF Applications
As wireless products use higher frequencies and demand higher density packaging solutions,the roles of electrical
interconnects and substrate technologies become increasingly important. Flip ch
.. read more
New Laminates for High Reliability Printed Circuit Boards
The challenges for today’s PCBs are many,including higher assembly temperatures and higher device heat transfer
temperatures; faster clock cycles and higher bandwidths; higher component density
.. read more
Signal Integrity Analysis Techniques used to Characterize PCB Substrates
The electrical properties of PCB substrates are one of the primary factors used in designing high-frequency printed circuit
boards. The loss tangent is the electrical property used by material
.. read more
Three Reasons Why You Should Design Your Next Product With Laser Drilled Micro-Vias
If in designing your next product you are interested in cost reduction,reliability improvement,and increased electrical performance,then you should be considering using laser-drilled vias. Not
.. read more
Realization of a New Concept for Power Chip Embedding
Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top
.. read more
New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
.. read more
A Designed Experiment for the Influence of Copper Foils on Impedance,DC Line Resistance and Insertion Loss
For the last couple of years,the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently,the need to reduce insertion loss came
.. read more
Understanding when to use FR-4 laminates or High Frequency Laminates
Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has
.. read more
PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems
For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
.. read more
High Frequency Circuit Materials used in the PCB Industry
Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There are several attributes of these materials that are very unique wh
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Effects of Adhesion Promotion Treatment On Electrical Signal Attenuation
Oxide alternatives,as well as traditional and reduced oxide chemistries,are coatings or “adhesion promoters” used to enhance the bond between imaged and etched inner layer copper surfaces and t
.. read more
Using Embedded Capacitance to Improve Electrical Performance,Eliminate Capacitors and Reduce Board Size In High Speed Digital and RF Applications
The global electronics industry is exhibiting a widespread and growing interest in the technology of embedded passives. This interest can be attributed to three primary benefits. First,embedded
.. read more
Ribbon Bonding For RF Applications
As wireless products use higher frequencies and demand higher density packaging solutions,the roles of electrical
interconnects and substrate technologies become increasingly important. Flip ch
.. read more
New Laminates for High Reliability Printed Circuit Boards
The challenges for today’s PCBs are many,including higher assembly temperatures and higher device heat transfer
temperatures; faster clock cycles and higher bandwidths; higher component density
.. read more
Signal Integrity Analysis Techniques used to Characterize PCB Substrates
The electrical properties of PCB substrates are one of the primary factors used in designing high-frequency printed circuit
boards. The loss tangent is the electrical property used by material
.. read more
Three Reasons Why You Should Design Your Next Product With Laser Drilled Micro-Vias
If in designing your next product you are interested in cost reduction,reliability improvement,and increased electrical performance,then you should be considering using laser-drilled vias. Not
.. read more