Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Evaluation of Transient Phase Conductive Material and Copper PCB Construction
Traditional PCB fabrication technology incorporates copper-plated vias after each press lamination connecting with microvias or mechanical vias. Conductive epoxy or transient phase conductiv
.. read more
Utilizing Quilt Packaging of PCB "Boardlets" to Enable Secure, Affordable, Modernized systems
Indiana Integrated Circuits has developed "Quilted" modular PCBs. They consist of multiple small "boardlets" with traces or pads on rough edges of the boards. These rough edges f
.. read more
Electrical Testing of Passive Components
Substrates have become more critical with regard to pitch and density in today’s designs with challenges for passive components in terms of surface placement. This negates the opportunity for h
.. read more
Electrical Test Conditions & Considerations
When testing PCBs it can be quite confusing as to what method to use,parameters are necessary for the Performance Class and what cost to associate in the build to way against the long term reli
.. read more
IPC 9252A Electrical Test Considerations & Military Specifications versus Electrical Test (Know Your Specifications,Revisions and Amendments)
The PCB industry has advanced significantly in the recent millennium. OEM specifications and requirements have also advanced due to the maturing technologies. With this the requirements of Elec
.. read more
A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations
This paper details the Alcatel-Lucent Pb-free Material Reliability Test board (MRT) used in two different High Density Packaging User Group tests covering 56 different constructions and in nume
.. read more
Thin Film Embedded Resistor Processing in Sequential Lamination Printed Circuit
New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators
.. read more
Thin Film Embedded Resistor Processing in Sequential Lamination Printed Circuit
New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators
.. read more
Evaluation of Transient Phase Conductive Material and Copper PCB Construction
Traditional PCB fabrication technology incorporates copper-plated vias after each press lamination connecting with microvias or mechanical vias. Conductive epoxy or transient phase conductiv
.. read more
Utilizing Quilt Packaging of PCB "Boardlets" to Enable Secure, Affordable, Modernized systems
Indiana Integrated Circuits has developed "Quilted" modular PCBs. They consist of multiple small "boardlets" with traces or pads on rough edges of the boards. These rough edges f
.. read more
Electrical Testing of Passive Components
Substrates have become more critical with regard to pitch and density in today’s designs with challenges for passive components in terms of surface placement. This negates the opportunity for h
.. read more
Electrical Test Conditions & Considerations
When testing PCBs it can be quite confusing as to what method to use,parameters are necessary for the Performance Class and what cost to associate in the build to way against the long term reli
.. read more
IPC 9252A Electrical Test Considerations & Military Specifications versus Electrical Test (Know Your Specifications,Revisions and Amendments)
The PCB industry has advanced significantly in the recent millennium. OEM specifications and requirements have also advanced due to the maturing technologies. With this the requirements of Elec
.. read more
A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations
This paper details the Alcatel-Lucent Pb-free Material Reliability Test board (MRT) used in two different High Density Packaging User Group tests covering 56 different constructions and in nume
.. read more
Thin Film Embedded Resistor Processing in Sequential Lamination Printed Circuit
New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators
.. read more
Thin Film Embedded Resistor Processing in Sequential Lamination Printed Circuit
New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators
.. read more