Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Improving Tin Whisker Testing through Quantitative Measurements of Plated Film Properties
- Correlating film properties to the propensity to whisker will lead to the development of a comprehensive whisker growth model and create successful mitigation strategies.
•Hillock and whisker
.. read more
Effects of Solder Mask on Electrochemical Migration of Tin-Lead and Lead-Free Boards
Electrochemical migration (ECM) is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM can cause a reduction i
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
New Positive Working Dry Film Resist
We will present a new positive working dry film resist system that is suitable for high accuracy use. The new positive working dry film resist is composed of base polymers with active hydrogen
.. read more
Improving Tin Whisker Testing through Quantitative Measurements of Plated Film Properties
- Correlating film properties to the propensity to whisker will lead to the development of a comprehensive whisker growth model and create successful mitigation strategies.
•Hillock and whisker
.. read more
Effects of Solder Mask on Electrochemical Migration of Tin-Lead and Lead-Free Boards
Electrochemical migration (ECM) is the growth of conductive metal filaments on a printed circuit board (PCB) through an electrolyte solution under a DC voltage bias. ECM can cause a reduction i
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
New Positive Working Dry Film Resist
We will present a new positive working dry film resist system that is suitable for high accuracy use. The new positive working dry film resist is composed of base polymers with active hydrogen
.. read more