Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Controlling Recrystallisation in Plated Layers Through the Use of Additives
This work compares the influence of a plating additive that has been applied to a commercially available electroless copper system and how its use impacts the morphology of the overall final
.. read more
A Production Viable, Palladium Free Activation Process for Electroless Copper Deposition
For many years, the electroless copper process has been widely used by the PCB and package substrate industries, where a wide process window and proven product reliability has led to it bein
.. read more
High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing
Two new electroless copper baths have been developed to cope with upcoming miniaturization challenges in the high-end IC substrate segment as well as in the evolving HDI board market. The main
.. read more
Chemical “Kick Start” for the Autocatalytic Formaldehyde-Free Electroless Copper Plating Process
The present work describes the use of additives in formaldehyde-free copper solutions to improve the start reaction of
electroless copper deposition.
Conventional electroless copper plating sol
.. read more
Influence of Electroless Copper on IC Reliability
The process of plating through holes (PTH) is inherent to modern PCB manufacturing. In an arena of increasing circuit density and layer counts,the reliability of the PTH process is under consta
.. read more
Effect of Plasma Surface Treatment for Peel Strength of Metallization Based on Polyimide
The purpose of this study is to investigate the optimum plasma processing as a pre-treatment for the surface of Polyimide (PI) in order to increase adhesion strength of electroless copper (Cu)
.. read more
Flexible PCB Plating Through Hole Considerations,Experiences and Solutions
Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels
there is an extreme need for improved PTH processing. There are sev
.. read more
PTFE Wettability for Electroless Copper and Direct Metallization
PTFE material is very hydrophobic and among the most difficult to deposit electroless copper or direct metallization. These
materials have very low friction,which makes a surface non-wettable.
.. read more
Controlling Recrystallisation in Plated Layers Through the Use of Additives
This work compares the influence of a plating additive that has been applied to a commercially available electroless copper system and how its use impacts the morphology of the overall final
.. read more
A Production Viable, Palladium Free Activation Process for Electroless Copper Deposition
For many years, the electroless copper process has been widely used by the PCB and package substrate industries, where a wide process window and proven product reliability has led to it bein
.. read more
High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing
Two new electroless copper baths have been developed to cope with upcoming miniaturization challenges in the high-end IC substrate segment as well as in the evolving HDI board market. The main
.. read more
Chemical “Kick Start” for the Autocatalytic Formaldehyde-Free Electroless Copper Plating Process
The present work describes the use of additives in formaldehyde-free copper solutions to improve the start reaction of
electroless copper deposition.
Conventional electroless copper plating sol
.. read more
Influence of Electroless Copper on IC Reliability
The process of plating through holes (PTH) is inherent to modern PCB manufacturing. In an arena of increasing circuit density and layer counts,the reliability of the PTH process is under consta
.. read more
Effect of Plasma Surface Treatment for Peel Strength of Metallization Based on Polyimide
The purpose of this study is to investigate the optimum plasma processing as a pre-treatment for the surface of Polyimide (PI) in order to increase adhesion strength of electroless copper (Cu)
.. read more
Flexible PCB Plating Through Hole Considerations,Experiences and Solutions
Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels
there is an extreme need for improved PTH processing. There are sev
.. read more
PTFE Wettability for Electroless Copper and Direct Metallization
PTFE material is very hydrophobic and among the most difficult to deposit electroless copper or direct metallization. These
materials have very low friction,which makes a surface non-wettable.
.. read more