Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Thermal Stress Reliability of Stacked Microvias Fabricated with a Liquid Metal Ink Semi-Additive Process
Latent reliability issues with stacked filled microvia designs for complex printed circuit boards fabricated using subtractive-etch processes have been well-documented in recent years. This
.. read more
The Complete Path to Least Resistance
The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on P
.. read more
A High Reliability,Stress-free Copper Deposit for FPC,Polyimide,and Rigid-Flex
Today’s wide variety of laminate materials and specialized dielectric choices pose a challenge for process engineering. In particular,smooth surfaces,such as polyimide,flex circuit substrates a
.. read more
Thermal Stress Reliability of Stacked Microvias Fabricated with a Liquid Metal Ink Semi-Additive Process
Latent reliability issues with stacked filled microvia designs for complex printed circuit boards fabricated using subtractive-etch processes have been well-documented in recent years. This
.. read more
The Complete Path to Least Resistance
The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on P
.. read more
A High Reliability,Stress-free Copper Deposit for FPC,Polyimide,and Rigid-Flex
Today’s wide variety of laminate materials and specialized dielectric choices pose a challenge for process engineering. In particular,smooth surfaces,such as polyimide,flex circuit substrates a
.. read more