Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift
As a surface finish for PCBs,Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with
.. read more
Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo
.. read more
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd- Layers
As a surface finish,electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention
for both packaging/IC-substrate and PWB applications. With a lower gold
.. read more
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish
We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal
cycle (TC) by varying the thickness of Palladium (Pd) in Electrole
.. read more
Why Electroless Palladium: Study on Impact of Electroless Palladium on Electroless Nickel Deposits
Electroless nickel immersion gold (ENIG) has captured the major share of the lead free final finish market globally even though it’s not the least expensive. ENIG not only provides a robust met
.. read more
A Study of Reliability between Solder Alloy and Pad Materials
The low Ag solder alloy shows higher drop performance than the high Ag solder alloy in the every kind of package and board combinations. This is related to the ductility of solder and the surfa
.. read more
Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift
As a surface finish for PCBs,Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with
.. read more
Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo
.. read more
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd- Layers
As a surface finish,electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention
for both packaging/IC-substrate and PWB applications. With a lower gold
.. read more
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish
We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal
cycle (TC) by varying the thickness of Palladium (Pd) in Electrole
.. read more
Why Electroless Palladium: Study on Impact of Electroless Palladium on Electroless Nickel Deposits
Electroless nickel immersion gold (ENIG) has captured the major share of the lead free final finish market globally even though it’s not the least expensive. ENIG not only provides a robust met
.. read more
A Study of Reliability between Solder Alloy and Pad Materials
The low Ag solder alloy shows higher drop performance than the high Ag solder alloy in the every kind of package and board combinations. This is related to the ductility of solder and the surfa
.. read more