Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Semi-Additive Process for Variant Polyimide Substrates in Ultra-Fine Flexible Circuitry
Ultra-fine flexible circuitry has been more and more applied in electronic devices due to their fast innovation and the increasing demand on miniaturization,light weight and flexibility in some
.. read more
Influence of Plating Quality on Reliability of Microvias
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multi
.. read more
An Analytical Analysis of the Fluid Mechanics Involved In PCB Plating
It has been the conventional wisdom of the industry that the predominate board parameter associated with through hole plating is the aspect ratio of the through hole. While this is intuitively
.. read more
Microvia Reliability Concerns in the Lead Free Assembly Environment
Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). With the advent of lead free assembly the vulnerability of high
.. read more
Semi-Additive Process for Variant Polyimide Substrates in Ultra-Fine Flexible Circuitry
Ultra-fine flexible circuitry has been more and more applied in electronic devices due to their fast innovation and the increasing demand on miniaturization,light weight and flexibility in some
.. read more
Influence of Plating Quality on Reliability of Microvias
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multi
.. read more
An Analytical Analysis of the Fluid Mechanics Involved In PCB Plating
It has been the conventional wisdom of the industry that the predominate board parameter associated with through hole plating is the aspect ratio of the through hole. While this is intuitively
.. read more
Microvia Reliability Concerns in the Lead Free Assembly Environment
Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). With the advent of lead free assembly the vulnerability of high
.. read more