Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Physics-of-Failure Approach to Integrated Circuit Reliability
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode
.. read more
Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode
.. read more
Cleaning Qualification Methodology for Inline Aqueous Assembly Process
An assessment to measure the cleanliness of the area underneath a component has been completed. The assessment uses an 8”×9”×0.093” test vehicle with FR4 laminate,OSP surface finishing,and 21 p
.. read more
Impact Evaluation of Solder Transfer Peak Temperatures on C4NP Lead Free Solder Bumps
C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and
commercialized by Suss MicroTec. C4NP is a solder transfer technology where mol
.. read more
Removal of Palladium Residue in Semi-Additive Process for Enhanced Reliability in
In order to satisfy the ever-increasing demand for smaller and lighter electronic devices,a drastic miniaturization is making
rapid progresses for even circuit features on printed wiring boards
.. read more
Enhanced Eutectic Solder Bump for Increased Flip Chip Reliability
Applications using flip chips in high temperature and high current designs have increased in recent years,and this trend is
expected to continue. Markets utilizing these designs include high pe
.. read more
The Study,Measurement,and Prevention of Tarnish on Immersion Silver Board Finishes
With increased environmental legislation against lead in the electronics industry1,circuit board manufacturers are
expecting chemical suppliers to formulate lead free alternatives with the same
.. read more
Characterization and Measurement of BGA Solder Joint Alloy Phase Solid State Thermal and Electromigration
A number of prior studies have established that solid state migration of solder alloy elemental phases will occur as a
function of temperature,time and voltage bias through the solder joint. Th
.. read more
Current Carrying Capability of Electrically Conductive Adhesives for High Power Applications
Various Ag-filled epoxies were subjected to a current carrying capability study in which current was applied to the
epoxies at temperatures of up to 170°C for 1008 hours. Test devices with Ag e
.. read more
Physics-of-Failure Approach to Integrated Circuit Reliability
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode
.. read more
Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode
.. read more
Cleaning Qualification Methodology for Inline Aqueous Assembly Process
An assessment to measure the cleanliness of the area underneath a component has been completed. The assessment uses an 8”×9”×0.093” test vehicle with FR4 laminate,OSP surface finishing,and 21 p
.. read more
Impact Evaluation of Solder Transfer Peak Temperatures on C4NP Lead Free Solder Bumps
C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and
commercialized by Suss MicroTec. C4NP is a solder transfer technology where mol
.. read more
Removal of Palladium Residue in Semi-Additive Process for Enhanced Reliability in
In order to satisfy the ever-increasing demand for smaller and lighter electronic devices,a drastic miniaturization is making
rapid progresses for even circuit features on printed wiring boards
.. read more
Enhanced Eutectic Solder Bump for Increased Flip Chip Reliability
Applications using flip chips in high temperature and high current designs have increased in recent years,and this trend is
expected to continue. Markets utilizing these designs include high pe
.. read more
The Study,Measurement,and Prevention of Tarnish on Immersion Silver Board Finishes
With increased environmental legislation against lead in the electronics industry1,circuit board manufacturers are
expecting chemical suppliers to formulate lead free alternatives with the same
.. read more
Characterization and Measurement of BGA Solder Joint Alloy Phase Solid State Thermal and Electromigration
A number of prior studies have established that solid state migration of solder alloy elemental phases will occur as a
function of temperature,time and voltage bias through the solder joint. Th
.. read more
Current Carrying Capability of Electrically Conductive Adhesives for High Power Applications
Various Ag-filled epoxies were subjected to a current carrying capability study in which current was applied to the
epoxies at temperatures of up to 170°C for 1008 hours. Test devices with Ag e
.. read more