Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Selective Solder Nozzles: Insight Into Wear Mechanisms and Future Developments
Selective soldering utilizes wettable metal nozzles for controlled application of solder to components. The wetting of solder to the nozzles is part of a complex mechanism that causes wear o
.. read more
C4NP Lead Free vs. Electroplated High Lead Solder Bumps
There are various C4 (Controlled Collapse Chip Connection) solder bumping technologies used in volume production. These
include electroplating,solder paste printing,evaporation and the direct a
.. read more
Fluxless Sn-Ag Solder Joints between Silicon and Ag-Cladded Copper with Reliability Evaluations--MEJ
A fluxless bonding process between silicon and copper using Sn-rich Ag-Sn-Au multilayer composite has been developed.
The copper substrate is plated with a silver layer as stress buffer. We bon
.. read more
Improving Printed Circuit Board Plating with Eductor Agitation
This paper will review eductor agitation systems at PWB installations to improve the electroplating of printed circuit boards.
Significant environmental and productivity improvements have been
.. read more
Electroplating and Properties of Lead-Free Finishes
Tin alloys such as Sn 0.7% Cu and Sn 2%Bi were identified as a viable alternative to tin-lead finish. Electroplating
of these alloys is challenging because of great difference in reduction pote
.. read more
Selective Solder Nozzles: Insight Into Wear Mechanisms and Future Developments
Selective soldering utilizes wettable metal nozzles for controlled application of solder to components. The wetting of solder to the nozzles is part of a complex mechanism that causes wear o
.. read more
C4NP Lead Free vs. Electroplated High Lead Solder Bumps
There are various C4 (Controlled Collapse Chip Connection) solder bumping technologies used in volume production. These
include electroplating,solder paste printing,evaporation and the direct a
.. read more
Fluxless Sn-Ag Solder Joints between Silicon and Ag-Cladded Copper with Reliability Evaluations--MEJ
A fluxless bonding process between silicon and copper using Sn-rich Ag-Sn-Au multilayer composite has been developed.
The copper substrate is plated with a silver layer as stress buffer. We bon
.. read more
Improving Printed Circuit Board Plating with Eductor Agitation
This paper will review eductor agitation systems at PWB installations to improve the electroplating of printed circuit boards.
Significant environmental and productivity improvements have been
.. read more
Electroplating and Properties of Lead-Free Finishes
Tin alloys such as Sn 0.7% Cu and Sn 2%Bi were identified as a viable alternative to tin-lead finish. Electroplating
of these alloys is challenging because of great difference in reduction pote
.. read more