Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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3D Printing of Plastic Structures onto PCBs for Circuit Protection Strategies

This paper describes the novel use of Fused Filament Fabrication (FFF) 3D-printing technology to create plastic, positioning and retaining structures directly onto the surface of standard FR .. read more

Use of Underfill to Enhance the Thermal Cycling Reliability of Small BGAs

In this work,we have evaluated the use of underfill to enhance the reliability of small BGAs in the automotive thermal cycling environment. Best parameters for underfilling of BGAs were develop .. read more

Key Application Issues for Implementing Package-Applied Underfill

Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable in that it would eliminate the underfill process from the end-users assemb .. read more

3D Printing of Plastic Structures onto PCBs for Circuit Protection Strategies

This paper describes the novel use of Fused Filament Fabrication (FFF) 3D-printing technology to create plastic, positioning and retaining structures directly onto the surface of standard FR .. read more

Use of Underfill to Enhance the Thermal Cycling Reliability of Small BGAs

In this work,we have evaluated the use of underfill to enhance the reliability of small BGAs in the automotive thermal cycling environment. Best parameters for underfilling of BGAs were develop .. read more

Key Application Issues for Implementing Package-Applied Underfill

Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable in that it would eliminate the underfill process from the end-users assemb .. read more