Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Solder Joint Embrittlement Mechanisms,Solutions and Standards
The change to lead-free solders in electronic assemblies created a need to replace tin-lead solderable termination finishes with materials such as pure tin or soft gold,on electronic component
.. read more
Copper Tin Intermetallic Crystals and Their Role in the Formation of Microbridges between the Leads of Hand Reworked Fine Pitch...
Wave soldering is a mature manufacturing process that metallurgically joins component and PWB termination features by
passing them together across the flowing surface of a molten solder reservo
.. read more
Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints
During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format
.. read more
Solder Joint Embrittlement Mechanisms,Solutions and Standards
The change to lead-free solders in electronic assemblies created a need to replace tin-lead solderable termination finishes with materials such as pure tin or soft gold,on electronic component
.. read more
Copper Tin Intermetallic Crystals and Their Role in the Formation of Microbridges between the Leads of Hand Reworked Fine Pitch...
Wave soldering is a mature manufacturing process that metallurgically joins component and PWB termination features by
passing them together across the flowing surface of a molten solder reservo
.. read more
Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints
During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format
.. read more