Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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New Phosphorus-Based Curing Agents for PWB
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials. Although the epoxy resin defines the ther
.. read more
Insulation Material for Next Generation Packaging Substrates
With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor
devices are required to cope with finer patterning and higher wiring densi
.. read more
New Phosphorus-Based Curing Agents for PWB
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials. Although the epoxy resin defines the ther
.. read more
Insulation Material for Next Generation Packaging Substrates
With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor
devices are required to cope with finer patterning and higher wiring densi
.. read more