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A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. read more
Recovery of Copper Metal in the Continuous Regeneration of Cupric Chloride Etchant
An electrochemical device has been developed that deposits non adherent copper metal powder at the cathode,and generates chlorine gas at the anode. The chlorine is contained within the system,a
.. read more
Cupric Chloride-Hydrochloric Acid Microetch Roughening Process and its Applications
We have developed a cupric chloride-hydrochloric acid based microetchant process. This process provides a unique roughened copper surface,which yields excellent adhesion for both solder mask an
.. read more
High Uniformity PCB Processing with Vacuum Gas Plasma
Emerging technologies in the printed circuit board industry including smaller holes,higher aspect ratios,three-dimensional features,fine pitch,blind via holes,and new lead free materials contin
.. read more
Enhancing Interlaminar Bond Strength for High Performance Resin Systems and Liquid Photoimageable Soldermasks with an Organo-metallic Copper Surface Treatment Process
The technology shift toward higher performance (low Dk,low Df,faster signal speeds) resin materials for high reliability
high layer count multlayer interconnect devices is moving rapidly. PWB f
.. read more
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. read more
Recovery of Copper Metal in the Continuous Regeneration of Cupric Chloride Etchant
An electrochemical device has been developed that deposits non adherent copper metal powder at the cathode,and generates chlorine gas at the anode. The chlorine is contained within the system,a
.. read more
Cupric Chloride-Hydrochloric Acid Microetch Roughening Process and its Applications
We have developed a cupric chloride-hydrochloric acid based microetchant process. This process provides a unique roughened copper surface,which yields excellent adhesion for both solder mask an
.. read more
High Uniformity PCB Processing with Vacuum Gas Plasma
Emerging technologies in the printed circuit board industry including smaller holes,higher aspect ratios,three-dimensional features,fine pitch,blind via holes,and new lead free materials contin
.. read more
Enhancing Interlaminar Bond Strength for High Performance Resin Systems and Liquid Photoimageable Soldermasks with an Organo-metallic Copper Surface Treatment Process
The technology shift toward higher performance (low Dk,low Df,faster signal speeds) resin materials for high reliability
high layer count multlayer interconnect devices is moving rapidly. PWB f
.. read more