Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Optimising Solder Paste Volume for Low Temperature Reflow of BGA Packages
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower proc
.. read more
A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications
The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield,eliminate the head-in-pillow effect,and enhance re
.. read more
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
.. read more
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. read more
Optimising Solder Paste Volume for Low Temperature Reflow of BGA Packages
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower proc
.. read more
A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications
The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield,eliminate the head-in-pillow effect,and enhance re
.. read more
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
.. read more
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. read more