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Microstructural Evolution and Damage Mechanisms in Pb-Free Solder Joints During Extended -40 Degrees C to 125 Degrees C Thermal Cycles
A comparative study of package-to-board interconnections of a 1.27mm pitch BGA package using two Pb-free alloys and Sn-Pb solder in extended –40 to 125°C thermal cycling is described. The micro
.. read more
Microstructural Evolution and Damage Mechanisms in Pb-Free Solder Joints During Extended -40 Degrees C to 125 Degrees C Thermal Cycles
A comparative study of package-to-board interconnections of a 1.27mm pitch BGA package using two Pb-free alloys and Sn-Pb solder in extended –40 to 125°C thermal cycling is described. The micro
.. read more