Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Reducing Dust Deposition on Electronic Equipment by Optimizing Cooling Air Flow Patterns
Environmental dust accumulation on electronic equipment can impact the performance and reliability of the equipment in various ways. This includes mechanical effects (such as obstructions of
.. read more
Interconnect Reliability Correlation with System Design and Transportation Stress
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping c
.. read more
The Gap Dilemma in the Technical Cleanliness of Electronic Assemblies – Why Foreign Object Debris on Electronic Assemblies is not...
Technical Cleanliness, i.e., the quantification, control and mitigation of deleterious effects of foreign object debris (FOD), is a common challenge in engineering. In the context of electro
.. read more
A Critical Analysis of CAF Testing-- Temperature, Humidity, and the Reality of Field Performance
As Conductive Anodic Filament (CAF) testing on Printed Circuit Boards (PCBs) approaches 50 years of industry attention, the chemistry of formation in the lab environment is well documented,
.. read more
Failure Analysis Cases Studies on Solder De-Wetting For Electronics Products
Over many years defect analysis has been used at the company to determine the root cause of various defects experienced in the field on electronic products from customers. Based on this work
.. read more
A Method to Investigate Printed Circuit Board Supplier Rework Processes and Best Practices
Several incidents occurred that prompted a team to investigate Printed Circuit Board (PCB) supplier best practices and rework procedures. Two of the more prominent incidents that occurred an
.. read more
Reducing Dust Deposition on Electronic Equipment by Optimizing Cooling Air Flow Patterns
Environmental dust accumulation on electronic equipment can impact the performance and reliability of the equipment in various ways. This includes mechanical effects (such as obstructions of
.. read more
Interconnect Reliability Correlation with System Design and Transportation Stress
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping c
.. read more
The Gap Dilemma in the Technical Cleanliness of Electronic Assemblies – Why Foreign Object Debris on Electronic Assemblies is not...
Technical Cleanliness, i.e., the quantification, control and mitigation of deleterious effects of foreign object debris (FOD), is a common challenge in engineering. In the context of electro
.. read more
A Critical Analysis of CAF Testing-- Temperature, Humidity, and the Reality of Field Performance
As Conductive Anodic Filament (CAF) testing on Printed Circuit Boards (PCBs) approaches 50 years of industry attention, the chemistry of formation in the lab environment is well documented,
.. read more
Failure Analysis Cases Studies on Solder De-Wetting For Electronics Products
Over many years defect analysis has been used at the company to determine the root cause of various defects experienced in the field on electronic products from customers. Based on this work
.. read more
A Method to Investigate Printed Circuit Board Supplier Rework Processes and Best Practices
Several incidents occurred that prompted a team to investigate Printed Circuit Board (PCB) supplier best practices and rework procedures. Two of the more prominent incidents that occurred an
.. read more