Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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RoHS: 10 Years Later - IT Equipment Corrosion Issues Remain
The European Union RoHS directive took effect in 2006,and of the 6 restricted materials,the elimination of lead from electronic devices took the most development effort and had the worst degrad
.. read more
Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode
.. read more
Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing
High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur
.. read more
A Closer Look at why Cleaning prior to Conformal Coating becomes Key in Aspects of Climatic Reliability?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide move towards lead-free manufacturing,has initiated a closer assessment of eff
.. read more
Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World
The plated thru hole has changed considerably in 50 years of electronic packaging,but in its many forms remains the most
common interconnection in 1st and 2nd level electronic packaging,and is
.. read more
Microstructural Evolution and Damage Mechanisms in Pb-Free Solder Joints During Extended -40 Degrees C to 125 Degrees C Thermal Cycles
A comparative study of package-to-board interconnections of a 1.27mm pitch BGA package using two Pb-free alloys and Sn-Pb solder in extended –40 to 125°C thermal cycling is described. The micro
.. read more
RoHS: 10 Years Later - IT Equipment Corrosion Issues Remain
The European Union RoHS directive took effect in 2006,and of the 6 restricted materials,the elimination of lead from electronic devices took the most development effort and had the worst degrad
.. read more
Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode
.. read more
Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing
High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur
.. read more
A Closer Look at why Cleaning prior to Conformal Coating becomes Key in Aspects of Climatic Reliability?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide move towards lead-free manufacturing,has initiated a closer assessment of eff
.. read more
Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World
The plated thru hole has changed considerably in 50 years of electronic packaging,but in its many forms remains the most
common interconnection in 1st and 2nd level electronic packaging,and is
.. read more
Microstructural Evolution and Damage Mechanisms in Pb-Free Solder Joints During Extended -40 Degrees C to 125 Degrees C Thermal Cycles
A comparative study of package-to-board interconnections of a 1.27mm pitch BGA package using two Pb-free alloys and Sn-Pb solder in extended –40 to 125°C thermal cycling is described. The micro
.. read more