Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Creating Reusable Manufacturing Tests for High-Speed I/O with Synthetic Instruments
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second(Gbps) to several hundred Gbps. While manufacturing te
.. read more
Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed
.. read more
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
This paper presents lead-free ball grid array (BGA) packages subjected to two ball removal and two ball attachment techniques. Solder attach strength is used as a metric to examine the reballin
.. read more
RoHS and Green Compliance in IC Packaging
In this report,BGA packages with conventional and green material combination were selected as test vehicles for the investigation of MSL/temperature rating at the packaging level. The IC packag
.. read more
Microvia Reliability Concerns in the Lead Free Assembly Environment
Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). With the advent of lead free assembly the vulnerability of high
.. read more
Creating Reusable Manufacturing Tests for High-Speed I/O with Synthetic Instruments
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second(Gbps) to several hundred Gbps. While manufacturing te
.. read more
Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed
.. read more
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
This paper presents lead-free ball grid array (BGA) packages subjected to two ball removal and two ball attachment techniques. Solder attach strength is used as a metric to examine the reballin
.. read more
RoHS and Green Compliance in IC Packaging
In this report,BGA packages with conventional and green material combination were selected as test vehicles for the investigation of MSL/temperature rating at the packaging level. The IC packag
.. read more
Microvia Reliability Concerns in the Lead Free Assembly Environment
Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). With the advent of lead free assembly the vulnerability of high
.. read more