Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Failure Modes in Wire bonded and Flip Chip Packages
The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly proce
.. read more
Moisture Diffusion in Electronic Packaging Materials
Moisture poses a significant threat to the reliability of microelectronic assemblies,especially for scientific research products that are designed for marine environment and can be attributed a
.. read more
The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal...
The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids
.. read more
Embedded Components: A Comparative Analysis of Reliability
In light of new process and product technologies in the field of embedded components,questions arise with respect to
advantages and potential disadvantages to standard SMT component placement w
.. read more
Strategies for the Prevention of Board Strain and Cracked Chips in Automotive Electronics
BGA’s,ceramic capacitors,and similar strain sensitive components are used extensively throughout the automotive and consumer electronics industries. Unfortunately these components can be easily
.. read more
Effect of Environmental Stress and Bias Conditions on Reliability of Embedded Planar Capacitors
The reliability of an embedded planar capacitor laminate under a variety of environmental stress and bias conditions was investigated. The dielectric consisted of a composite of BaTiO3 particle
.. read more
Microvia Reliability Failure Modes
Recent increases in assembly temperatures in response to removing lead from solder used in printed circuit boards (PCBs)
assembly has increase the strain and stress on interconnect structures.
.. read more
Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards
The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo
.. read more
Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World
The plated thru hole has changed considerably in 50 years of electronic packaging,but in its many forms remains the most
common interconnection in 1st and 2nd level electronic packaging,and is
.. read more
Advances in Plating Technology: Reliable High Aspect Ratio’s
The Semiconductor industry is demanding more and more from today’s PWB manufacturers. This paper offers some insights to the needs,requirements,solutions and process verifications that R&D Circ
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. read more
Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process
For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products,there is a growing concern abo
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
Effects of BGA Rework Cycles on PCB Assembly Reliability
BGA component removal and replacement are required during product development and repair operations. In general,a single rework on specific location is permitted without causing excessive damag
.. read more
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. read more
Conductive Anodic Filament (CAF) Formation: An Historic Perspective
Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and
high voltage gradient conditions. The filament,a copper salt,grows from a
.. read more
Failure Modes in Wire bonded and Flip Chip Packages
The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly proce
.. read more
Moisture Diffusion in Electronic Packaging Materials
Moisture poses a significant threat to the reliability of microelectronic assemblies,especially for scientific research products that are designed for marine environment and can be attributed a
.. read more
The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal...
The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids
.. read more
Embedded Components: A Comparative Analysis of Reliability
In light of new process and product technologies in the field of embedded components,questions arise with respect to
advantages and potential disadvantages to standard SMT component placement w
.. read more
Strategies for the Prevention of Board Strain and Cracked Chips in Automotive Electronics
BGA’s,ceramic capacitors,and similar strain sensitive components are used extensively throughout the automotive and consumer electronics industries. Unfortunately these components can be easily
.. read more
Effect of Environmental Stress and Bias Conditions on Reliability of Embedded Planar Capacitors
The reliability of an embedded planar capacitor laminate under a variety of environmental stress and bias conditions was investigated. The dielectric consisted of a composite of BaTiO3 particle
.. read more
Microvia Reliability Failure Modes
Recent increases in assembly temperatures in response to removing lead from solder used in printed circuit boards (PCBs)
assembly has increase the strain and stress on interconnect structures.
.. read more
Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards
The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo
.. read more
Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World
The plated thru hole has changed considerably in 50 years of electronic packaging,but in its many forms remains the most
common interconnection in 1st and 2nd level electronic packaging,and is
.. read more
Advances in Plating Technology: Reliable High Aspect Ratio’s
The Semiconductor industry is demanding more and more from today’s PWB manufacturers. This paper offers some insights to the needs,requirements,solutions and process verifications that R&D Circ
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. read more
Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process
For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products,there is a growing concern abo
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
Effects of BGA Rework Cycles on PCB Assembly Reliability
BGA component removal and replacement are required during product development and repair operations. In general,a single rework on specific location is permitted without causing excessive damag
.. read more
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. read more
Conductive Anodic Filament (CAF) Formation: An Historic Perspective
Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and
high voltage gradient conditions. The filament,a copper salt,grows from a
.. read more