Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effect of Encapsulation Materials on Tensile Stress During Thermo-Mechanical Cycling of Pb-Free Solder Joints
Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However,variability in the mec
.. read more
Constitutive and Failure Behavior of SnAgCu Solder Joints
Constitutive and failure descriptions of SnAgCu solder alloys are of great interest at the present. Commonly,constitutive models that have been successfully used in the past for Sn-Pb solders a
.. read more
Effect of Encapsulation Materials on Tensile Stress During Thermo-Mechanical Cycling of Pb-Free Solder Joints
Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However,variability in the mec
.. read more
Constitutive and Failure Behavior of SnAgCu Solder Joints
Constitutive and failure descriptions of SnAgCu solder alloys are of great interest at the present. Commonly,constitutive models that have been successfully used in the past for Sn-Pb solders a
.. read more