Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effect of Encapsulation Materials on Tensile Stress During Thermo-Mechanical Cycling of Pb-Free Solder Joints
Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However,variability in the mec
.. read more
Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework
The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material
.. read more
Prediction of Digital Circuit Board Reliability Using Computational Reliability Modeling
A process called computational reliability modeling is described herein as well as how the reliability predictions from this
modeling approach match experimental data (both lead and lead-free s
.. read more
Capabilities of Tools Used to Measure Voids to Industry Standards
It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and
specifically BGAs. There have been many publications which discuss this phenomena,
.. read more
Effect of Encapsulation Materials on Tensile Stress During Thermo-Mechanical Cycling of Pb-Free Solder Joints
Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However,variability in the mec
.. read more
Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework
The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material
.. read more
Prediction of Digital Circuit Board Reliability Using Computational Reliability Modeling
A process called computational reliability modeling is described herein as well as how the reliability predictions from this
modeling approach match experimental data (both lead and lead-free s
.. read more
Capabilities of Tools Used to Measure Voids to Industry Standards
It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and
specifically BGAs. There have been many publications which discuss this phenomena,
.. read more