Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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New Reinforcement Material can Solve Heat and Co-Efficient of Thermal Expansion Challenges of the Printed Circuit Board and IC Substrate
Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s
.. read more
Aerosol-Based Direct Writing of Interconnects
Optomec is developing an aerosol-based technology for high-precision,maskless deposition of a wide variety of
materials. The system functions by atomizing commercial inks and pastes,and then de
.. read more
New Reinforcement Material can Solve Heat and Co-Efficient of Thermal Expansion Challenges of the Printed Circuit Board and IC Substrate
Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s
.. read more
Aerosol-Based Direct Writing of Interconnects
Optomec is developing an aerosol-based technology for high-precision,maskless deposition of a wide variety of
materials. The system functions by atomizing commercial inks and pastes,and then de
.. read more