Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Additive Manufacturing of a Heat Exchanger for a Radar System
The defense industry has realized the importance of Additive Manufacturing (AM) and how this technology can be utilized where parts can be fabricated inexpensively with reduction in lead tim
.. read more
Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias
The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. The benefits of embedding active die
.. read more
Simulation of Embedded Components in PCB Environment and Verification of Board Reliability
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Small modules with embedded dies and passive components on the top
.. read more
Warpage Optimization of Printed Circuit Boards with Embedded Active and Passive Components
Importance of the properties during curing:
- Curing analysis has to be carried in a PCB level to improve understanding warpage mechanism. Specially it is very important in a laminating process
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
Constitutive and Failure Behavior of SnAgCu Solder Joints
Constitutive and failure descriptions of SnAgCu solder alloys are of great interest at the present. Commonly,constitutive models that have been successfully used in the past for Sn-Pb solders a
.. read more
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. read more
New Methods to Efficiently Test the Reliability of Plated Vias and to Model Plated Via Life from Laminate Material Data
This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and
.. read more
Additive Manufacturing of a Heat Exchanger for a Radar System
The defense industry has realized the importance of Additive Manufacturing (AM) and how this technology can be utilized where parts can be fabricated inexpensively with reduction in lead tim
.. read more
Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias
The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. The benefits of embedding active die
.. read more
Simulation of Embedded Components in PCB Environment and Verification of Board Reliability
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Small modules with embedded dies and passive components on the top
.. read more
Warpage Optimization of Printed Circuit Boards with Embedded Active and Passive Components
Importance of the properties during curing:
- Curing analysis has to be carried in a PCB level to improve understanding warpage mechanism. Specially it is very important in a laminating process
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
Constitutive and Failure Behavior of SnAgCu Solder Joints
Constitutive and failure descriptions of SnAgCu solder alloys are of great interest at the present. Commonly,constitutive models that have been successfully used in the past for Sn-Pb solders a
.. read more
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. read more
New Methods to Efficiently Test the Reliability of Plated Vias and to Model Plated Via Life from Laminate Material Data
This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and
.. read more