Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Developments in Electroless Copper Processes to Improve Performance in am SAPMobile Applications
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnec
.. read more
Factors Affecting the Adhesion of Thin Film Copper on Polyimide
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described [1] an approach to very
.. read more
Developments in Electroless Copper Processes to Improve Performance in am SAPMobile Applications
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnec
.. read more
Factors Affecting the Adhesion of Thin Film Copper on Polyimide
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described [1] an approach to very
.. read more