Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Material Selection and Parameter Optimization for Reliable TMV Pop Assembly
The successful integration of package-on-package (PoP) stacking utilizing through mold via (TMV) technology hinges on a robust assembly process. In this study,seven dip materials were investiga
.. read more
Improving Tin Whisker Testing through Quantitative Measurements of Plated Film Properties
- Correlating film properties to the propensity to whisker will lead to the development of a comprehensive whisker growth model and create successful mitigation strategies.
•Hillock and whisker
.. read more
Peel Strength of Deposited Adhesiveless FCCL,Or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim
.. read more
Material Selection and Parameter Optimization for Reliable TMV Pop Assembly
The successful integration of package-on-package (PoP) stacking utilizing through mold via (TMV) technology hinges on a robust assembly process. In this study,seven dip materials were investiga
.. read more
Improving Tin Whisker Testing through Quantitative Measurements of Plated Film Properties
- Correlating film properties to the propensity to whisker will lead to the development of a comprehensive whisker growth model and create successful mitigation strategies.
•Hillock and whisker
.. read more
Peel Strength of Deposited Adhesiveless FCCL,Or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim
.. read more