Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Backdrill Under BGAHigh Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA si
.. read more
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. read more
Backdrill Under BGAHigh Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA si
.. read more
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. read more