Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Prediction of Drop Impact Reliability for Electronics Using Finite Element Analyses
This paper presents some of the recent in-situ studies of drop impact reliability for electronic equipment using Finite Element Analyses. The work covers simulation methods, verification wit
.. read more
Prediction of Whisker Growth Positions at Press-Fit Connections Using Finite Element Analysis
Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of
.. read more
A Case Study on Evaluating Manual and Automated Heat Sink Assembly using FEA and Testing
Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly,a detailed manual process is often utilized. However
.. read more
Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a
.. read more
Simulation of Embedded Components in PCB Environment and Verification of Board Reliability
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Small modules with embedded dies and passive components on the top
.. read more
Moisture Diffusion in Electronic Packaging Materials
Moisture poses a significant threat to the reliability of microelectronic assemblies,especially for scientific research products that are designed for marine environment and can be attributed a
.. read more
Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints,which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. Th
.. read more
Automated Design Analysis: Reliability Modeling of Circuit Card Assemblies
It is widely known and understood that the overall cost and quality of a product is most influenced by decisions made early in the design stage. Finding and correcting design flaws later in the
.. read more
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. read more
Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR
For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics
miniaturization and densification. Numerous technologies issued from v
.. read more
Pad Cratering Evaluation of PCB
Pad cratering in the PCB is a new failure mode encountered in electronic assemblies,particularly in lead-free products. The
failure mechanisms and root causes are not yet fully understood,and l
.. read more
FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
.. read more
Micro Drill Bit Design on the Basis of the Combination of Theoretical Analysis,Numerical Simulation and Experimental Verification
To improve the design efficiency of a micro drill bit,a method on the basis of the combination of theoretical analysis,numerical simulation and experimental verifications is presented. As examp
.. read more
Signal Integrity Analysis Techniques used to Characterize PCB Substrates
The electrical properties of PCB substrates are one of the primary factors used in designing high-frequency printed circuit
boards. The loss tangent is the electrical property used by material
.. read more
Solder Joint Thermal Fatigue Damage Evaluation by a Simplified Method
In the present study,a simplified analysis methodology is used to evaluate thermal fatigue damage of solder joints of
a leadless ceramic chip carrier (LCCC) or a leadless chip capacitor/resisto
.. read more
Board Level Interconnect Reliability Assessment of High I/O BGA Packages
To meet the complex design requirements of the electronics industry,there is an increased need for large size high
I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+
.. read more
Component Damage from Printed Circuit Board Loading
Electronic components are being used in increasingly more severe shock environments. This combined with an
industry trend of increased component reliability to help reduce electronic system dow
.. read more
Experimental and Numerical Assessment of Plated Via Reliability
This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing
or observed during manufacturing. Finite element models have been developed
.. read more
An FEA Study of Image Transfer in Printed Wiring Boards
A concern in the manufacture of laminate PWB’s is the transfer of interior circuit patterns to the surface of the
board. This can lead to difficulties in forming the external circuitry. Typical
.. read more
Prediction of Drop Impact Reliability for Electronics Using Finite Element Analyses
This paper presents some of the recent in-situ studies of drop impact reliability for electronic equipment using Finite Element Analyses. The work covers simulation methods, verification wit
.. read more
Prediction of Whisker Growth Positions at Press-Fit Connections Using Finite Element Analysis
Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of
.. read more
A Case Study on Evaluating Manual and Automated Heat Sink Assembly using FEA and Testing
Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly,a detailed manual process is often utilized. However
.. read more
Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a
.. read more
Simulation of Embedded Components in PCB Environment and Verification of Board Reliability
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Small modules with embedded dies and passive components on the top
.. read more
Moisture Diffusion in Electronic Packaging Materials
Moisture poses a significant threat to the reliability of microelectronic assemblies,especially for scientific research products that are designed for marine environment and can be attributed a
.. read more
Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints,which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. Th
.. read more
Automated Design Analysis: Reliability Modeling of Circuit Card Assemblies
It is widely known and understood that the overall cost and quality of a product is most influenced by decisions made early in the design stage. Finding and correcting design flaws later in the
.. read more
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. read more
Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR
For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics
miniaturization and densification. Numerous technologies issued from v
.. read more
Pad Cratering Evaluation of PCB
Pad cratering in the PCB is a new failure mode encountered in electronic assemblies,particularly in lead-free products. The
failure mechanisms and root causes are not yet fully understood,and l
.. read more
FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
.. read more
Micro Drill Bit Design on the Basis of the Combination of Theoretical Analysis,Numerical Simulation and Experimental Verification
To improve the design efficiency of a micro drill bit,a method on the basis of the combination of theoretical analysis,numerical simulation and experimental verifications is presented. As examp
.. read more
Signal Integrity Analysis Techniques used to Characterize PCB Substrates
The electrical properties of PCB substrates are one of the primary factors used in designing high-frequency printed circuit
boards. The loss tangent is the electrical property used by material
.. read more
Solder Joint Thermal Fatigue Damage Evaluation by a Simplified Method
In the present study,a simplified analysis methodology is used to evaluate thermal fatigue damage of solder joints of
a leadless ceramic chip carrier (LCCC) or a leadless chip capacitor/resisto
.. read more
Board Level Interconnect Reliability Assessment of High I/O BGA Packages
To meet the complex design requirements of the electronics industry,there is an increased need for large size high
I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+
.. read more
Component Damage from Printed Circuit Board Loading
Electronic components are being used in increasingly more severe shock environments. This combined with an
industry trend of increased component reliability to help reduce electronic system dow
.. read more
Experimental and Numerical Assessment of Plated Via Reliability
This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing
or observed during manufacturing. Finite element models have been developed
.. read more
An FEA Study of Image Transfer in Printed Wiring Boards
A concern in the manufacture of laminate PWB’s is the transfer of interior circuit patterns to the surface of the
board. This can lead to difficulties in forming the external circuitry. Typical
.. read more