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Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. read more
Comparative Analysis of Solder Joint Degradation Using RF Impedance and Event Detectors
Under cycling loading conditions,solder joints are susceptible to fatigue cracking,which often initiates at the surface where the strain range is maximized. Event detectors have been widely use
.. read more
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. read more
Comparative Analysis of Solder Joint Degradation Using RF Impedance and Event Detectors
Under cycling loading conditions,solder joints are susceptible to fatigue cracking,which often initiates at the surface where the strain range is maximized. Event detectors have been widely use
.. read more