Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Reliability SoH Degradation and Life Prediction of Thin Flexible Batteries Under Flex-to-Install Dynamic Folding Dynamic Twisting and Battery Lamination
The emergence of a variety of flexible portable electronics applications has led to increased attention to flexible power sources. Flexible electronics may be subjected to static and dynamic
.. read more
A Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb Solder
The movement to Pb-free soldering will result in solder joints that are significantly stiffer than those made of SnPb. This
paper presents the results from the first phase of a two-part study t
.. read more
Flexible PCB Plating Through Hole Considerations,Experiences and Solutions
Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels
there is an extreme need for improved PTH processing. There are sev
.. read more
R/flex® 3000 Advanced Circuit Materials = LCP Stability & Performance from 1GHz to 110 GHz
This paper will discuss how R/flex® 3000 LCP materials from Rogers Corporation are "pushing the envelope" for high -
frequency & flex designs by examining:
1. How the material set has now been
.. read more
Reliability SoH Degradation and Life Prediction of Thin Flexible Batteries Under Flex-to-Install Dynamic Folding Dynamic Twisting and Battery Lamination
The emergence of a variety of flexible portable electronics applications has led to increased attention to flexible power sources. Flexible electronics may be subjected to static and dynamic
.. read more
A Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb Solder
The movement to Pb-free soldering will result in solder joints that are significantly stiffer than those made of SnPb. This
paper presents the results from the first phase of a two-part study t
.. read more
Flexible PCB Plating Through Hole Considerations,Experiences and Solutions
Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels
there is an extreme need for improved PTH processing. There are sev
.. read more
R/flex® 3000 Advanced Circuit Materials = LCP Stability & Performance from 1GHz to 110 GHz
This paper will discuss how R/flex® 3000 LCP materials from Rogers Corporation are "pushing the envelope" for high -
frequency & flex designs by examining:
1. How the material set has now been
.. read more